LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4,...

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Hauptverfasser: MIYAIRI AKIRA, OKIKAWA SUSUMU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MIYAIRI AKIRA
OKIKAWA SUSUMU
description PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4, resin 11 is fed into the holes 5 when a package is molded to completely stop moving the lead 4. Thus, the bonding of the lead 4 to the package resin 11 is extremely strengthened. A circular-arc portion 8 is formed at the connecting portion of the tab 3 to the lead 4 to increase the width of the connecting portion. Since the width of the connecting portion is thus wide, the stress can be that much dispersed with the result of effectively preventing a pellet from cracking due to the stress concentration.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME
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