QUICK-CURING POWDER COATING COMPOSITION

PURPOSE:To obtain a powder coating compsn. which is quick-curing and gives a coating film having excellent characteristics, by blending an epoxy resin, an active hydrogen-contg. compd., a silanol group-contg. silicon compd. and an organometallic compd. CONSTITUTION:A powder coating compsn. contains...

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Hauptverfasser: HAYASE SHUJI, SUZUKI SHIYUICHI
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creator HAYASE SHUJI
SUZUKI SHIYUICHI
description PURPOSE:To obtain a powder coating compsn. which is quick-curing and gives a coating film having excellent characteristics, by blending an epoxy resin, an active hydrogen-contg. compd., a silanol group-contg. silicon compd. and an organometallic compd. CONSTITUTION:A powder coating compsn. contains an epoxy resin (A), an active hydrogen-contg. compd. (B), a silicon compd. (C) which contains a silanol group or can form a silanol group, and an organometallic compd. (D) As the compd. (B), phenol compds. and amine compds. are preferred, among which compds. wherein an OH, NH2 or NH group is directly attached to an aryl group ar particularly preferred. The silicon compd. (C) is used as a curing catalyst for the epoxy resin. As the organometallic compd. (D), organoaluminum compds. are particularly preferred.
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CONSTITUTION:A powder coating compsn. contains an epoxy resin (A), an active hydrogen-contg. compd. (B), a silicon compd. (C) which contains a silanol group or can form a silanol group, and an organometallic compd. (D) As the compd. (B), phenol compds. and amine compds. are preferred, among which compds. wherein an OH, NH2 or NH group is directly attached to an aryl group ar particularly preferred. The silicon compd. (C) is used as a curing catalyst for the epoxy resin. As the organometallic compd. 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CONSTITUTION:A powder coating compsn. contains an epoxy resin (A), an active hydrogen-contg. compd. (B), a silicon compd. (C) which contains a silanol group or can form a silanol group, and an organometallic compd. (D) As the compd. (B), phenol compds. and amine compds. are preferred, among which compds. wherein an OH, NH2 or NH group is directly attached to an aryl group ar particularly preferred. The silicon compd. (C) is used as a curing catalyst for the epoxy resin. As the organometallic compd. (D), organoaluminum compds. are particularly preferred.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
USE OF MATERIALS THEREFOR
WOODSTAINS
title QUICK-CURING POWDER COATING COMPOSITION
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