RESIN COMPOSITION FOR PREPREG AND PRODUCTION THEREOF
PURPOSE:The titled composition capable of giving a prepreg having good impact resistance and excellent heat and water resistance, tackiness as well as moldability, by blending a specific curing agent and thermoplastic resin consisting of a polyether sulfone with a novel epoxy resin using a specific...
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| creator | SUZUE SHIGERU |
| description | PURPOSE:The titled composition capable of giving a prepreg having good impact resistance and excellent heat and water resistance, tackiness as well as moldability, by blending a specific curing agent and thermoplastic resin consisting of a polyether sulfone with a novel epoxy resin using a specific method. CONSTITUTION:A composition, obtained by pulverizing and dissolving (A) a polyether sulfone which is a thermoplastic resin of formula I [part of the structural units may be substituted by units of formula II (Q is H, NH2, etc.,)] in (B) an epoxy resin of formula III (either one of R1 and R2 is CH3 and the other is H) at 100-180 deg.C without using a solvent, cooling the resultant solution to =1 poise in a heating process at a rate of 1.5 deg.C/min. The component (B) is, e.g. obtained by cyclizing an adduct of aminocresol obtained from cresols with an epihalohydrin. |
| format | Patent |
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CONSTITUTION:A composition, obtained by pulverizing and dissolving (A) a polyether sulfone which is a thermoplastic resin of formula I [part of the structural units may be substituted by units of formula II (Q is H, NH2, etc.,)] in (B) an epoxy resin of formula III (either one of R1 and R2 is CH3 and the other is H) at 100-180 deg.C without using a solvent, cooling the resultant solution to <=100 deg.C and blending with (C) diaminodiphenyl sulfone which is a curing agent, consisting essentially of the components (A)-(C) and having the lowest viscosity of >=1 poise in a heating process at a rate of 1.5 deg.C/min. 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CONSTITUTION:A composition, obtained by pulverizing and dissolving (A) a polyether sulfone which is a thermoplastic resin of formula I [part of the structural units may be substituted by units of formula II (Q is H, NH2, etc.,)] in (B) an epoxy resin of formula III (either one of R1 and R2 is CH3 and the other is H) at 100-180 deg.C without using a solvent, cooling the resultant solution to <=100 deg.C and blending with (C) diaminodiphenyl sulfone which is a curing agent, consisting essentially of the components (A)-(C) and having the lowest viscosity of >=1 poise in a heating process at a rate of 1.5 deg.C/min. The component (B) is, e.g. obtained by cyclizing an adduct of aminocresol obtained from cresols with an epihalohydrin.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | RESIN COMPOSITION FOR PREPREG AND PRODUCTION THEREOF |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T21%3A24%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUZUE%20SHIGERU&rft.date=1987-12-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS62297312A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |