JPS6228567B

PURPOSE:To enable speedy processing of data by discriminating the kind of each chip on a water, shifting later processing programs in a die sort testing device according to the kind of the chip and thus performing the test of all chips. CONSTITUTION:A discrimination area 4 is set in the prescribed position of each chip on the wafer S, while in this area is formed a pattern wherein the strength of reflection of a laser beam is different for an IC chip 1, a basic element test element chip 2 and a process test element chip 3, respectively. In the die sort testing device, measuring programs corresponding to respective measuring modes of the IC chip, the basic element test element and the process test element are incorporated beforehand, the kind of each chip arranged on the wafer S is discriminated through the sequential inspection by the laser beam and the measuring programs are shifted corresponding to the discrimination, whereby a prescribed measurement of characteristic is performed. By constituting the device in this way, the speedy processing of data can be performed.