THERMAL COUPLING OF HEAT CONDUCTING ELEMENT AND ELECTRONIC CIRCUIT CHIP

A method of attachment of a thermally conductive element (26) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (36,40). During the extrusion, the ox...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	EFUREIMU BEMISU FURINTO, RONARUDO FURANKURIN MAAKUSU, AASAA RICHIYAADO JINGAA, GURAHAMU ORIIBU, PIITAA ARUFURETSUDO GURUBAA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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