THERMAL COUPLING OF HEAT CONDUCTING ELEMENT AND ELECTRONIC CIRCUIT CHIP
A method of attachment of a thermally conductive element (26) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (36,40). During the extrusion, the ox...
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| creator | EFUREIMU BEMISU FURINTO RONARUDO FURANKURIN MAAKUSU AASAA RICHIYAADO JINGAA GURAHAMU ORIIBU PIITAA ARUFURETSUDO GURUBAA |
| description | A method of attachment of a thermally conductive element (26) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (36,40). During the extrusion, the oxide coating (54) is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill (56) or section (74) of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS62269346A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS62269346A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS62269346A3</originalsourceid><addsrcrecordid>eNrjZHAP8XAN8nX0UXD2Dw3w8fRzV_B3U_BwdQwBCvi5hDqHgIRcfVx9Xf1CFBz9XEBs55Agfz9PZwVnzyDnUE-gSg_PAB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu8VEGxmZGRmaWxi5mhMjBoAzV0swQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMAL COUPLING OF HEAT CONDUCTING ELEMENT AND ELECTRONIC CIRCUIT CHIP</title><source>esp@cenet</source><creator>EFUREIMU BEMISU FURINTO ; RONARUDO FURANKURIN MAAKUSU ; AASAA RICHIYAADO JINGAA ; GURAHAMU ORIIBU ; PIITAA ARUFURETSUDO GURUBAA</creator><creatorcontrib>EFUREIMU BEMISU FURINTO ; RONARUDO FURANKURIN MAAKUSU ; AASAA RICHIYAADO JINGAA ; GURAHAMU ORIIBU ; PIITAA ARUFURETSUDO GURUBAA</creatorcontrib><description>A method of attachment of a thermally conductive element (26) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (36,40). During the extrusion, the oxide coating (54) is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill (56) or section (74) of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1987</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19871121&DB=EPODOC&CC=JP&NR=S62269346A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19871121&DB=EPODOC&CC=JP&NR=S62269346A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>EFUREIMU BEMISU FURINTO</creatorcontrib><creatorcontrib>RONARUDO FURANKURIN MAAKUSU</creatorcontrib><creatorcontrib>AASAA RICHIYAADO JINGAA</creatorcontrib><creatorcontrib>GURAHAMU ORIIBU</creatorcontrib><creatorcontrib>PIITAA ARUFURETSUDO GURUBAA</creatorcontrib><title>THERMAL COUPLING OF HEAT CONDUCTING ELEMENT AND ELECTRONIC CIRCUIT CHIP</title><description>A method of attachment of a thermally conductive element (26) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (36,40). During the extrusion, the oxide coating (54) is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill (56) or section (74) of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1987</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAP8XAN8nX0UXD2Dw3w8fRzV_B3U_BwdQwBCvi5hDqHgIRcfVx9Xf1CFBz9XEBs55Agfz9PZwVnzyDnUE-gSg_PAB4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEu8VEGxmZGRmaWxi5mhMjBoAzV0swQ</recordid><startdate>19871121</startdate><enddate>19871121</enddate><creator>EFUREIMU BEMISU FURINTO</creator><creator>RONARUDO FURANKURIN MAAKUSU</creator><creator>AASAA RICHIYAADO JINGAA</creator><creator>GURAHAMU ORIIBU</creator><creator>PIITAA ARUFURETSUDO GURUBAA</creator><scope>EVB</scope></search><sort><creationdate>19871121</creationdate><title>THERMAL COUPLING OF HEAT CONDUCTING ELEMENT AND ELECTRONIC CIRCUIT CHIP</title><author>EFUREIMU BEMISU FURINTO ; RONARUDO FURANKURIN MAAKUSU ; AASAA RICHIYAADO JINGAA ; GURAHAMU ORIIBU ; PIITAA ARUFURETSUDO GURUBAA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS62269346A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1987</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>EFUREIMU BEMISU FURINTO</creatorcontrib><creatorcontrib>RONARUDO FURANKURIN MAAKUSU</creatorcontrib><creatorcontrib>AASAA RICHIYAADO JINGAA</creatorcontrib><creatorcontrib>GURAHAMU ORIIBU</creatorcontrib><creatorcontrib>PIITAA ARUFURETSUDO GURUBAA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>EFUREIMU BEMISU FURINTO</au><au>RONARUDO FURANKURIN MAAKUSU</au><au>AASAA RICHIYAADO JINGAA</au><au>GURAHAMU ORIIBU</au><au>PIITAA ARUFURETSUDO GURUBAA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL COUPLING OF HEAT CONDUCTING ELEMENT AND ELECTRONIC CIRCUIT CHIP</title><date>1987-11-21</date><risdate>1987</risdate><abstract>A method of attachment of a thermally conductive element (26) to an electric circuit chip (22) for cooling the chip includes initial steps of forming an oxide-free preform (56) of a fusible metal alloy (50) by extrusion of alloy between two mold blocks or plates (36,40). During the extrusion, the oxide coating (54) is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill (56) or section (74) of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | THERMAL COUPLING OF HEAT CONDUCTING ELEMENT AND ELECTRONIC CIRCUIT CHIP |
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