SOCKET FOR MEASURING ELECTRIC CHARACTERISTICS OF SEMICONDUCTOR DEVICE
PURPOSE:To accurately measure the high frequency characteristics and the like of a semiconductor device by so composing that forces are operated to the inserting and perpendicular directions of the device to connect its lead pin to a socket. CONSTITUTION:When the electrode 12B of a chip carrier 12 i...
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| creator | IRIKURA SHOGO OURA TAKAYUKI BABA TERUYOSHI SONODA YASUHIRO MIZUE KATSUYA |
| description | PURPOSE:To accurately measure the high frequency characteristics and the like of a semiconductor device by so composing that forces are operated to the inserting and perpendicular directions of the device to connect its lead pin to a socket. CONSTITUTION:When the electrode 12B of a chip carrier 12 is placed on the end 10A of the lead pin 10 provided at a socket body 15 and a cover 11 is closed, the pin 10 is engaged with the groove 12A on the side of the carrier 12, the electrode 12B is pressed by the end 10A of the pin to a carrier inserting direction and a perpendicular direction, supported by a supporting portion 12C, and mechanically and electrically effectively bonded. When the lower portion 10D of the pin is linearly minimized in size, the electric capacity, inductance and resistance value of the socket can be reduced to minimize the influence at the time of measuring characteristics. |
| format | Patent |
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CONSTITUTION:When the electrode 12B of a chip carrier 12 is placed on the end 10A of the lead pin 10 provided at a socket body 15 and a cover 11 is closed, the pin 10 is engaged with the groove 12A on the side of the carrier 12, the electrode 12B is pressed by the end 10A of the pin to a carrier inserting direction and a perpendicular direction, supported by a supporting portion 12C, and mechanically and electrically effectively bonded. When the lower portion 10D of the pin is linearly minimized in size, the electric capacity, inductance and resistance value of the socket can be reduced to minimize the influence at the time of measuring characteristics.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1987</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19870722&DB=EPODOC&CC=JP&NR=S62165958A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19870722&DB=EPODOC&CC=JP&NR=S62165958A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IRIKURA SHOGO</creatorcontrib><creatorcontrib>OURA TAKAYUKI</creatorcontrib><creatorcontrib>BABA TERUYOSHI</creatorcontrib><creatorcontrib>SONODA YASUHIRO</creatorcontrib><creatorcontrib>MIZUE KATSUYA</creatorcontrib><title>SOCKET FOR MEASURING ELECTRIC CHARACTERISTICS OF SEMICONDUCTOR DEVICE</title><description>PURPOSE:To accurately measure the high frequency characteristics and the like of a semiconductor device by so composing that forces are operated to the inserting and perpendicular directions of the device to connect its lead pin to a socket. CONSTITUTION:When the electrode 12B of a chip carrier 12 is placed on the end 10A of the lead pin 10 provided at a socket body 15 and a cover 11 is closed, the pin 10 is engaged with the groove 12A on the side of the carrier 12, the electrode 12B is pressed by the end 10A of the pin to a carrier inserting direction and a perpendicular direction, supported by a supporting portion 12C, and mechanically and electrically effectively bonded. When the lower portion 10D of the pin is linearly minimized in size, the electric capacity, inductance and resistance value of the socket can be reduced to minimize the influence at the time of measuring characteristics.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1987</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAN9nf2dg1RcPMPUvB1dQwODfL0c1dw9XF1DgnydFZw9nAMcnQOcQ3yDA7xdA5W8HdTCHb19XT293MJdQ4B6nFxDfN0duVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmRoZmppamFo7GxKgBAKKULJ4</recordid><startdate>19870722</startdate><enddate>19870722</enddate><creator>IRIKURA SHOGO</creator><creator>OURA TAKAYUKI</creator><creator>BABA TERUYOSHI</creator><creator>SONODA YASUHIRO</creator><creator>MIZUE KATSUYA</creator><scope>EVB</scope></search><sort><creationdate>19870722</creationdate><title>SOCKET FOR MEASURING ELECTRIC CHARACTERISTICS OF SEMICONDUCTOR DEVICE</title><author>IRIKURA SHOGO ; OURA TAKAYUKI ; BABA TERUYOSHI ; SONODA YASUHIRO ; MIZUE KATSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS62165958A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1987</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>IRIKURA SHOGO</creatorcontrib><creatorcontrib>OURA TAKAYUKI</creatorcontrib><creatorcontrib>BABA TERUYOSHI</creatorcontrib><creatorcontrib>SONODA YASUHIRO</creatorcontrib><creatorcontrib>MIZUE KATSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IRIKURA SHOGO</au><au>OURA TAKAYUKI</au><au>BABA TERUYOSHI</au><au>SONODA YASUHIRO</au><au>MIZUE KATSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOCKET FOR MEASURING ELECTRIC CHARACTERISTICS OF SEMICONDUCTOR DEVICE</title><date>1987-07-22</date><risdate>1987</risdate><abstract>PURPOSE:To accurately measure the high frequency characteristics and the like of a semiconductor device by so composing that forces are operated to the inserting and perpendicular directions of the device to connect its lead pin to a socket. CONSTITUTION:When the electrode 12B of a chip carrier 12 is placed on the end 10A of the lead pin 10 provided at a socket body 15 and a cover 11 is closed, the pin 10 is engaged with the groove 12A on the side of the carrier 12, the electrode 12B is pressed by the end 10A of the pin to a carrier inserting direction and a perpendicular direction, supported by a supporting portion 12C, and mechanically and electrically effectively bonded. When the lower portion 10D of the pin is linearly minimized in size, the electric capacity, inductance and resistance value of the socket can be reduced to minimize the influence at the time of measuring characteristics.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | SOCKET FOR MEASURING ELECTRIC CHARACTERISTICS OF SEMICONDUCTOR DEVICE |
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