MANUFACTURE OF LEAD FRAME FOR SEMICONDUCTOR DEVICE

PURPOSE:To obtain, at low cost, a lead frame making it possible to increase reliability by a method wherein an Au coat is formed directly on a part to be a die pad element and/or an outer lead element and, after the exfoliation of a resist, the part is punched to be shaped in the main body of the le...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANEHIRO KAZUO, IGARASHI TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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