EPOXY RESIN COMPOSITION

PURPOSE:The titled composition useful as an electrical insulating material, etc., having improved dispersibility into epoxy resins, flexibility, toghness and electrical characteristics, containing an epoxy resin, a lactone ring opening polymer having a molecular weight of >= a specific value and...

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Bibliographische Detailangaben
1. Verfasser:	OSHIMA MASAYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:The titled composition useful as an electrical insulating material, etc., having improved dispersibility into epoxy resins, flexibility, toghness and electrical characteristics, containing an epoxy resin, a lactone ring opening polymer having a molecular weight of >= a specific value and a liquid acid anhydride type curing agent. CONSTITUTION:(A) An epoxy resin (preferably an epoxy resin containing >=1.5 epoxy groups per molecule, such as glycidyl ether type epoxy resin consisting of bisphenol A and epihalohydrin, etc.,) is blended with (B) a lactone ring opening polymer having >=5,000 molecular weight (preferably poly epsilon-caprolactam having 10,000-70,000 molecular weight and (C) a liquid acid anhydride type curing agent (preferably steric isomer mixture of methyl-DELTA -tetrahydrophethalic acid), to give the aimed composition. Preferably a weight ratio of the component A to B is 100:3-20 and an equivalent ratio of the component A to C is 10:6-12.