SEMICONDUCTOR DEVICE

PURPOSE:To mount chips with high density by pairing two frames, each loading the chips on these frames and sealing the chips by a single molding section so that the frames are not brought into contact mutually electrically. CONSTITUTION:A first frame 2 on which a chip 1 is loaded and a second frame...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ISHIKAWA MITSUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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