MEASURING DEVICE FOR WIRING SUBSTRATE

PURPOSE:To improve the quality of a wiring substrate by a method wherein the lower end of a warpage-measuring rod engaged slidably up and down and a temperature measurer provided at the lower end of the measuring rod are made to contact with the wiring substrate so as to reveal the relationship betw...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUKAI MAKOTO, OKI SACHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS PRINTED CIRCUITS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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