WIRE BONDING METHOD

PURPOSE:To prevent any crack in semiconductor chip from occurring by a method wherein, when a copper wire is bonded on an electrode, an end of capillary chip or an end of copper wire is heated by inert gas at high temperature. CONSTITUTION:When a ball 8 is formed at the end of a copper wire 1 pierce...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MACHIDA KAZUMICHI, HIROTA SANEYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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