SEALING OF ELECTRONIC ELEMENT

PURPOSE:To prevent a melted sealing pellet from sticking to a part outside an organic ring main body by a method wherein the organic ring main body is fixed on a print substrate using non-conductive epoxy resin to avoid making a gap between the print substrate and the organic ring. CONSTITUTION:When the projections of organic ring main body 2 are inserted into fixing holes 3 of the main body 2 to fix the main body 2 on a print substrate 1, non-conductive epoxy resin 9 is applied to fix the main body 2 to the print substrate 1. Later a chip part 5 is fixed to the print substrate 1 using conductive epoxy resin 4 to electrically connect the chip part 5 to surface electrode 6 mounted on the surface of print substrate 1 using bond wires 7. Then a sealing pellet 8 is mounted inside the organic ring main body 2 firstly to harden the sealing pellet 8 by pre-baking process. Through these procedures, the chip part 5 can be airtightly sealed to shield it from atmosphere for protecting it from the outside.