JPS6112033B
PURPOSE:To form a plating layer composed of Pt and Ir having low oxygen overvoltage at a low cost, by holding an weakly acid plating liquid containing a Pt compound, an Ir compound and NH2NH2 at one surface of an ion-exchange membrane, and letting an alkali solution penetrate into said membrane from...
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creator | KAMINO YASUYOSHI NAGAYA KIICHI NAKA YUKIHIKO |
description | PURPOSE:To form a plating layer composed of Pt and Ir having low oxygen overvoltage at a low cost, by holding an weakly acid plating liquid containing a Pt compound, an Ir compound and NH2NH2 at one surface of an ion-exchange membrane, and letting an alkali solution penetrate into said membrane from the other surface to perform reducing reaction. CONSTITUTION:A plating liquid containing a platinum compound (e.g. chloroplatinic acid), an Ir compound (e.g. IrCl4) and NH2NH2, and being adjusted to a pH of 5-6 is held at one surface of an ion-exchange membrane. The pH of the plating solution is adjusted by an aqueous alkali solution and maintained in said pH range by a buffer such as citric acid or sodium citrate. Under this condition, an alkali solution such as NaOH is let penetrate into the ion-exchange membrane from the other surface, so that the reducing reaction with NH2NH2 in the presence of the penetrating alkali is brought out on the former surface of said membrane. Thus, an electrode, esp. an anode, composed of Pt and Ir is formed on said membrane. |
format | Patent |
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CONSTITUTION:A plating liquid containing a platinum compound (e.g. chloroplatinic acid), an Ir compound (e.g. IrCl4) and NH2NH2, and being adjusted to a pH of 5-6 is held at one surface of an ion-exchange membrane. The pH of the plating solution is adjusted by an aqueous alkali solution and maintained in said pH range by a buffer such as citric acid or sodium citrate. Under this condition, an alkali solution such as NaOH is let penetrate into the ion-exchange membrane from the other surface, so that the reducing reaction with NH2NH2 in the presence of the penetrating alkali is brought out on the former surface of said membrane. Thus, an electrode, esp. an anode, composed of Pt and Ir is formed on said membrane.</description><language>eng</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRICITY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1986</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860405&DB=EPODOC&CC=JP&NR=S6112033B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860405&DB=EPODOC&CC=JP&NR=S6112033B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMINO YASUYOSHI</creatorcontrib><creatorcontrib>NAGAYA KIICHI</creatorcontrib><creatorcontrib>NAKA YUKIHIKO</creatorcontrib><title>JPS6112033B</title><description>PURPOSE:To form a plating layer composed of Pt and Ir having low oxygen overvoltage at a low cost, by holding an weakly acid plating liquid containing a Pt compound, an Ir compound and NH2NH2 at one surface of an ion-exchange membrane, and letting an alkali solution penetrate into said membrane from the other surface to perform reducing reaction. CONSTITUTION:A plating liquid containing a platinum compound (e.g. chloroplatinic acid), an Ir compound (e.g. IrCl4) and NH2NH2, and being adjusted to a pH of 5-6 is held at one surface of an ion-exchange membrane. The pH of the plating solution is adjusted by an aqueous alkali solution and maintained in said pH range by a buffer such as citric acid or sodium citrate. Under this condition, an alkali solution such as NaOH is let penetrate into the ion-exchange membrane from the other surface, so that the reducing reaction with NH2NH2 in the presence of the penetrating alkali is brought out on the former surface of said membrane. Thus, an electrode, esp. an anode, composed of Pt and Ir is formed on said membrane.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRICITY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1986</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD2Cgg2MzQ0MjA2duJhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFIOpyMjIlSBAB8dhxF</recordid><startdate>19860405</startdate><enddate>19860405</enddate><creator>KAMINO YASUYOSHI</creator><creator>NAGAYA KIICHI</creator><creator>NAKA YUKIHIKO</creator><scope>EVB</scope></search><sort><creationdate>19860405</creationdate><title>JPS6112033B</title><author>KAMINO YASUYOSHI ; NAGAYA KIICHI ; NAKA YUKIHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS6112033BB23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1986</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRICITY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMINO YASUYOSHI</creatorcontrib><creatorcontrib>NAGAYA KIICHI</creatorcontrib><creatorcontrib>NAKA YUKIHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMINO YASUYOSHI</au><au>NAGAYA KIICHI</au><au>NAKA YUKIHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JPS6112033B</title><date>1986-04-05</date><risdate>1986</risdate><abstract>PURPOSE:To form a plating layer composed of Pt and Ir having low oxygen overvoltage at a low cost, by holding an weakly acid plating liquid containing a Pt compound, an Ir compound and NH2NH2 at one surface of an ion-exchange membrane, and letting an alkali solution penetrate into said membrane from the other surface to perform reducing reaction. CONSTITUTION:A plating liquid containing a platinum compound (e.g. chloroplatinic acid), an Ir compound (e.g. IrCl4) and NH2NH2, and being adjusted to a pH of 5-6 is held at one surface of an ion-exchange membrane. The pH of the plating solution is adjusted by an aqueous alkali solution and maintained in said pH range by a buffer such as citric acid or sodium citrate. Under this condition, an alkali solution such as NaOH is let penetrate into the ion-exchange membrane from the other surface, so that the reducing reaction with NH2NH2 in the presence of the penetrating alkali is brought out on the former surface of said membrane. Thus, an electrode, esp. an anode, composed of Pt and Ir is formed on said membrane.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | JPS6112033B |
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