METHOD FOR VAPOR DEPOSITING ALUMINUM THIN LAYER

PURPOSE:To form Al thin film easy in ultrasonic bonding and superior in adhesive property and corrosion resistance, by vapor depositing Al in gas phase by vacuum vapor depositing method firstly, successively by ion plating method, at forming Al layer on surface of metal, ceramic, organic material, e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUDO KAZUNAO, KANEHIRO KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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