MOLDING DIE

PURPOSE:To improve the release property between the inner surface of a mold and a package by a structure wherein some portion of the inner surface of the mold is formed by imbedding release agents consisting of blocks made of material with release property onto the inner surface of the mold. CONSTIT...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MATSUZAWA ASAO, KIYONO MASAMI, HIRAI MICHIO, CHIBA TOSHIYUKI, KOMURO MASAMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To improve the release property between the inner surface of a mold and a package by a structure wherein some portion of the inner surface of the mold is formed by imbedding release agents consisting of blocks made of material with release property onto the inner surface of the mold. CONSTITUTION:Because block members 5 made of fluorine plastic, which has good release property from epoxy resin, are imbedded onto some portion of the molding surface of the cavities 2 of the top force 1a and the bottom force 1b of a mold 1, a package can easily be removed from the surface of the cavities 2 of the mold 1 without applying stress of the surface of the epoxy resin of the package, when a semiconductor device is intended to be taken out of the mold 1. In addition, because the semiconductor device is ejected by ejector pins 4, little stress is applied to the semiconductor device, resulting in very effectively enabling to prevent the separation of resin from a lead frame, pellet cracks and the like from occurring.