LIQUID-COOLED MODULE

PURPOSE:To obtain a liquid-cooled module having an excellent cooling function by vertically dipping and receiving wiring substrates constituting the module in a sealed vessel into which a refrigerant liquid is contained while a cooling plate is positioned between the wiring substrates and forcibly c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOKOUCHI KISHIO, NIWA KOUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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