LIQUID-COOLED MODULE
PURPOSE:To obtain a liquid-cooled module having an excellent cooling function by vertically dipping and receiving wiring substrates constituting the module in a sealed vessel into which a refrigerant liquid is contained while a cooling plate is positioned between the wiring substrates and forcibly c...
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| creator | YOKOUCHI KISHIO NIWA KOUICHI |
| description | PURPOSE:To obtain a liquid-cooled module having an excellent cooling function by vertically dipping and receiving wiring substrates constituting the module in a sealed vessel into which a refrigerant liquid is contained while a cooling plate is positioned between the wiring substrates and forcibly cooling the wiring substrates by cooling the cooling plate. CONSTITUTION:Connector terminals 8 having airtight structure are fitted to the bottom of a sealed vessel 7, and male contacts for substrates 9 are inserted and mounted. Cooling plates 10, the outsides thereof have a porous metal and the insides thereof have hoses, are arranged amoung substrates 9 vertically disposed in parallel, and a refrigerant is circulated from an upper section. The refrigerant 11 is entered in a shape that the substrates 9 are dipped completely. The cooling plate 10 is manufactured by covering the outside of the hose 12 with the porous tabular expanded metal, and bubbles generated by boiling and the refrigerant freely pass through the cooling plate through foamy void sections 13. Since the speed of passage of bubbles slows down, a large cooling effect is generated when water is passed through the hoses 12 to cool the title module. |
| format | Patent |
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CONSTITUTION:Connector terminals 8 having airtight structure are fitted to the bottom of a sealed vessel 7, and male contacts for substrates 9 are inserted and mounted. Cooling plates 10, the outsides thereof have a porous metal and the insides thereof have hoses, are arranged amoung substrates 9 vertically disposed in parallel, and a refrigerant is circulated from an upper section. The refrigerant 11 is entered in a shape that the substrates 9 are dipped completely. The cooling plate 10 is manufactured by covering the outside of the hose 12 with the porous tabular expanded metal, and bubbles generated by boiling and the refrigerant freely pass through the cooling plate through foamy void sections 13. Since the speed of passage of bubbles slows down, a large cooling effect is generated when water is passed through the hoses 12 to cool the title module.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850301&DB=EPODOC&CC=JP&NR=S6039855A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850301&DB=EPODOC&CC=JP&NR=S6039855A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOKOUCHI KISHIO</creatorcontrib><creatorcontrib>NIWA KOUICHI</creatorcontrib><title>LIQUID-COOLED MODULE</title><description>PURPOSE:To obtain a liquid-cooled module having an excellent cooling function by vertically dipping and receiving wiring substrates constituting the module in a sealed vessel into which a refrigerant liquid is contained while a cooling plate is positioned between the wiring substrates and forcibly cooling the wiring substrates by cooling the cooling plate. CONSTITUTION:Connector terminals 8 having airtight structure are fitted to the bottom of a sealed vessel 7, and male contacts for substrates 9 are inserted and mounted. Cooling plates 10, the outsides thereof have a porous metal and the insides thereof have hoses, are arranged amoung substrates 9 vertically disposed in parallel, and a refrigerant is circulated from an upper section. The refrigerant 11 is entered in a shape that the substrates 9 are dipped completely. The cooling plate 10 is manufactured by covering the outside of the hose 12 with the porous tabular expanded metal, and bubbles generated by boiling and the refrigerant freely pass through the cooling plate through foamy void sections 13. 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CONSTITUTION:Connector terminals 8 having airtight structure are fitted to the bottom of a sealed vessel 7, and male contacts for substrates 9 are inserted and mounted. Cooling plates 10, the outsides thereof have a porous metal and the insides thereof have hoses, are arranged amoung substrates 9 vertically disposed in parallel, and a refrigerant is circulated from an upper section. The refrigerant 11 is entered in a shape that the substrates 9 are dipped completely. The cooling plate 10 is manufactured by covering the outside of the hose 12 with the porous tabular expanded metal, and bubbles generated by boiling and the refrigerant freely pass through the cooling plate through foamy void sections 13. Since the speed of passage of bubbles slows down, a large cooling effect is generated when water is passed through the hoses 12 to cool the title module.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | LIQUID-COOLED MODULE |
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