FLATTENING OF SURFACE OF SUBSTRATE

PURPOSE:To contrive to enhance precision of abrasion of a semiconductor substrate by a method wherein an abrasion resistant layer formed on the surface part of the substrate other than grooves and having an abrading speed lower than a buried material is utilized as a stopper against mechanical abras...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KASE YUUSHI, TSUKAHARA MASARU, DEGUCHI TAKANORI, OSA YASUNOBU, ITOU KATSUHIKO, NOJIRI KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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