COOLING METHOD OF COOLING CAN
PURPOSE:To cool effectively a can with a less refrigerant in the stage of cooling a cylindrical can for transferring a high polymer film on the surface of which a thin film of a ferromagnetic metal is to be deposited by evaporation by evacuating the inside of the can and evaporating the refrigerant...
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| creator | SHIRAHATA RIYUUJI UENO WATARU KITAMOTO TATSUJI |
| description | PURPOSE:To cool effectively a can with a less refrigerant in the stage of cooling a cylindrical can for transferring a high polymer film on the surface of which a thin film of a ferromagnetic metal is to be deposited by evaporation by evacuating the inside of the can and evaporating the refrigerant with the inside wall surface. CONSTITUTION:While a high polymer film 3 of polyester, etc. is transferred by a cylindrical cooling can 4 under rotation in a vacuum vessel 1, a film deposited by evaporation is formed on the surface of said film by vapor flow 9 of the ferromagnetic metal in a crucible 7 by electron rays 6. The inside of the can 4 is evacuated in this case and a refrigerant such as water is evaporated under reduced pressure from the fine holes 15 on the inside surface of a water pipe 14 installed zigzag on the inside circumferential surface. The can 4 is effectively cooled by the heat of vaporization in such evaporation by which the can 4 and the film 3 in contact therewith are cooled with the smaller amt. of the refrigerant. The thin film of the ferromagnetic metal is thus stably deposited by evaporotion on the film 3 to a uniform thickness. |
| format | Patent |
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CONSTITUTION:While a high polymer film 3 of polyester, etc. is transferred by a cylindrical cooling can 4 under rotation in a vacuum vessel 1, a film deposited by evaporation is formed on the surface of said film by vapor flow 9 of the ferromagnetic metal in a crucible 7 by electron rays 6. The inside of the can 4 is evacuated in this case and a refrigerant such as water is evaporated under reduced pressure from the fine holes 15 on the inside surface of a water pipe 14 installed zigzag on the inside circumferential surface. The can 4 is effectively cooled by the heat of vaporization in such evaporation by which the can 4 and the film 3 in contact therewith are cooled with the smaller amt. of the refrigerant. The thin film of the ferromagnetic metal is thus stably deposited by evaporotion on the film 3 to a uniform thickness.</description><edition>4</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850108&DB=EPODOC&CC=JP&NR=S602665A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850108&DB=EPODOC&CC=JP&NR=S602665A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIRAHATA RIYUUJI</creatorcontrib><creatorcontrib>UENO WATARU</creatorcontrib><creatorcontrib>KITAMOTO TATSUJI</creatorcontrib><title>COOLING METHOD OF COOLING CAN</title><description>PURPOSE:To cool effectively a can with a less refrigerant in the stage of cooling a cylindrical can for transferring a high polymer film on the surface of which a thin film of a ferromagnetic metal is to be deposited by evaporation by evacuating the inside of the can and evaporating the refrigerant with the inside wall surface. CONSTITUTION:While a high polymer film 3 of polyester, etc. is transferred by a cylindrical cooling can 4 under rotation in a vacuum vessel 1, a film deposited by evaporation is formed on the surface of said film by vapor flow 9 of the ferromagnetic metal in a crucible 7 by electron rays 6. The inside of the can 4 is evacuated in this case and a refrigerant such as water is evaporated under reduced pressure from the fine holes 15 on the inside surface of a water pipe 14 installed zigzag on the inside circumferential surface. The can 4 is effectively cooled by the heat of vaporization in such evaporation by which the can 4 and the film 3 in contact therewith are cooled with the smaller amt. of the refrigerant. The thin film of the ferromagnetic metal is thus stably deposited by evaporotion on the film 3 to a uniform thickness.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1985</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB19vf38fRzV_B1DfHwd1Hwd1OAiTg7-vEwsKYl5hSn8kJpbgZ5N9cQZw_d1IL8-NTigsTk1LzUknivgGAzAyMzM1NHY8IqAAFwIEg</recordid><startdate>19850108</startdate><enddate>19850108</enddate><creator>SHIRAHATA RIYUUJI</creator><creator>UENO WATARU</creator><creator>KITAMOTO TATSUJI</creator><scope>EVB</scope></search><sort><creationdate>19850108</creationdate><title>COOLING METHOD OF COOLING CAN</title><author>SHIRAHATA RIYUUJI ; UENO WATARU ; KITAMOTO TATSUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS602665A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1985</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIRAHATA RIYUUJI</creatorcontrib><creatorcontrib>UENO WATARU</creatorcontrib><creatorcontrib>KITAMOTO TATSUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIRAHATA RIYUUJI</au><au>UENO WATARU</au><au>KITAMOTO TATSUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING METHOD OF COOLING CAN</title><date>1985-01-08</date><risdate>1985</risdate><abstract>PURPOSE:To cool effectively a can with a less refrigerant in the stage of cooling a cylindrical can for transferring a high polymer film on the surface of which a thin film of a ferromagnetic metal is to be deposited by evaporation by evacuating the inside of the can and evaporating the refrigerant with the inside wall surface. CONSTITUTION:While a high polymer film 3 of polyester, etc. is transferred by a cylindrical cooling can 4 under rotation in a vacuum vessel 1, a film deposited by evaporation is formed on the surface of said film by vapor flow 9 of the ferromagnetic metal in a crucible 7 by electron rays 6. The inside of the can 4 is evacuated in this case and a refrigerant such as water is evaporated under reduced pressure from the fine holes 15 on the inside surface of a water pipe 14 installed zigzag on the inside circumferential surface. The can 4 is effectively cooled by the heat of vaporization in such evaporation by which the can 4 and the film 3 in contact therewith are cooled with the smaller amt. of the refrigerant. The thin film of the ferromagnetic metal is thus stably deposited by evaporotion on the film 3 to a uniform thickness.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | COOLING METHOD OF COOLING CAN |
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