BONDING METHOD
PURPOSE:To carry out the bonding operation in high efficiency, preventing the adhesion of dust, etc. to the bonding surface, by bonding a light-transmitting plate to a molded article interposing a photo-crosslinking pressure-sensitive adhesive layer containing photo-crosslinking sensitizer, and irra...
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| creator | SATSUMA MICHIO NAKAGIRI TOSHIO IJICHI ICHIROU KANAI KAZUTO |
| description | PURPOSE:To carry out the bonding operation in high efficiency, preventing the adhesion of dust, etc. to the bonding surface, by bonding a light-transmitting plate to a molded article interposing a photo-crosslinking pressure-sensitive adhesive layer containing photo-crosslinking sensitizer, and irradiating the assembly with light from the side of the transparent plate to eliminate the tackiness of the exposed part. CONSTITUTION:A molded article (e.g. metallic or plastic rim or frame, etc.) is bonded to a part of a light-transmitting plate (e.g. an acrylic resin plate having a light-transmittance of 30-90% at 1,500-6,000Angstrom wavelength) using a photo- crosslinking pressure-sensitive adhesive layer containing a photo-crosslinking sensitizer (e.g. benzophenone), and the bonded assembly is irradiated with light from the side of the transparent plate to eliminate the tackiness of the adhesive layer to which the molded article is not bonded. The photo-crosslinking pressure-sensitive adhesive layer is preferably a laminated sheet containing a light- transmitting substrate such as a polyester film in the layer. EFFECT:The number of bonding steps, cost, and necessary period for bonding can be reduced. |
| format | Patent |
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CONSTITUTION:A molded article (e.g. metallic or plastic rim or frame, etc.) is bonded to a part of a light-transmitting plate (e.g. an acrylic resin plate having a light-transmittance of 30-90% at 1,500-6,000Angstrom wavelength) using a photo- crosslinking pressure-sensitive adhesive layer containing a photo-crosslinking sensitizer (e.g. benzophenone), and the bonded assembly is irradiated with light from the side of the transparent plate to eliminate the tackiness of the adhesive layer to which the molded article is not bonded. The photo-crosslinking pressure-sensitive adhesive layer is preferably a laminated sheet containing a light- transmitting substrate such as a polyester film in the layer. EFFECT:The number of bonding steps, cost, and necessary period for bonding can be reduced.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; GENERAL PROCESSES OF COMPOUNDING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL ; WORKING-UP</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850206&DB=EPODOC&CC=JP&NR=S6023468A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850206&DB=EPODOC&CC=JP&NR=S6023468A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SATSUMA MICHIO</creatorcontrib><creatorcontrib>NAKAGIRI TOSHIO</creatorcontrib><creatorcontrib>IJICHI ICHIROU</creatorcontrib><creatorcontrib>KANAI KAZUTO</creatorcontrib><title>BONDING METHOD</title><description>PURPOSE:To carry out the bonding operation in high efficiency, preventing the adhesion of dust, etc. to the bonding surface, by bonding a light-transmitting plate to a molded article interposing a photo-crosslinking pressure-sensitive adhesive layer containing photo-crosslinking sensitizer, and irradiating the assembly with light from the side of the transparent plate to eliminate the tackiness of the exposed part. CONSTITUTION:A molded article (e.g. metallic or plastic rim or frame, etc.) is bonded to a part of a light-transmitting plate (e.g. an acrylic resin plate having a light-transmittance of 30-90% at 1,500-6,000Angstrom wavelength) using a photo- crosslinking pressure-sensitive adhesive layer containing a photo-crosslinking sensitizer (e.g. benzophenone), and the bonded assembly is irradiated with light from the side of the transparent plate to eliminate the tackiness of the adhesive layer to which the molded article is not bonded. The photo-crosslinking pressure-sensitive adhesive layer is preferably a laminated sheet containing a light- transmitting substrate such as a polyester film in the layer. EFFECT:The number of bonding steps, cost, and necessary period for bonding can be reduced.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1985</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBz8vdz8fRzV_B1DfHwd-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmBkbGJmYWjsZEKAEAknccxw</recordid><startdate>19850206</startdate><enddate>19850206</enddate><creator>SATSUMA MICHIO</creator><creator>NAKAGIRI TOSHIO</creator><creator>IJICHI ICHIROU</creator><creator>KANAI KAZUTO</creator><scope>EVB</scope></search><sort><creationdate>19850206</creationdate><title>BONDING METHOD</title><author>SATSUMA MICHIO ; NAKAGIRI TOSHIO ; IJICHI ICHIROU ; KANAI KAZUTO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS6023468A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1985</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SATSUMA MICHIO</creatorcontrib><creatorcontrib>NAKAGIRI TOSHIO</creatorcontrib><creatorcontrib>IJICHI ICHIROU</creatorcontrib><creatorcontrib>KANAI KAZUTO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SATSUMA MICHIO</au><au>NAKAGIRI TOSHIO</au><au>IJICHI ICHIROU</au><au>KANAI KAZUTO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BONDING METHOD</title><date>1985-02-06</date><risdate>1985</risdate><abstract>PURPOSE:To carry out the bonding operation in high efficiency, preventing the adhesion of dust, etc. to the bonding surface, by bonding a light-transmitting plate to a molded article interposing a photo-crosslinking pressure-sensitive adhesive layer containing photo-crosslinking sensitizer, and irradiating the assembly with light from the side of the transparent plate to eliminate the tackiness of the exposed part. CONSTITUTION:A molded article (e.g. metallic or plastic rim or frame, etc.) is bonded to a part of a light-transmitting plate (e.g. an acrylic resin plate having a light-transmittance of 30-90% at 1,500-6,000Angstrom wavelength) using a photo- crosslinking pressure-sensitive adhesive layer containing a photo-crosslinking sensitizer (e.g. benzophenone), and the bonded assembly is irradiated with light from the side of the transparent plate to eliminate the tackiness of the adhesive layer to which the molded article is not bonded. The photo-crosslinking pressure-sensitive adhesive layer is preferably a laminated sheet containing a light- transmitting substrate such as a polyester film in the layer. EFFECT:The number of bonding steps, cost, and necessary period for bonding can be reduced.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPS6023468A |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP |
| title | BONDING METHOD |
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