RESIST COATER

PURPOSE:To prevent resist from being stretched like thread and to form easily a resist film with a uniform thickness, by setting up removably stoppers in the vessel. CONSTITUTION:A wafer fastener 24 which fixes a semiconductor wafer 23 is mounted on the tip of the rotating axis 20. A plural of stopp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAITOU KAZUYUKI, KATOU CHIHARU, TSUJI HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent resist from being stretched like thread and to form easily a resist film with a uniform thickness, by setting up removably stoppers in the vessel. CONSTITUTION:A wafer fastener 24 which fixes a semiconductor wafer 23 is mounted on the tip of the rotating axis 20. A plural of stoppers 28 each consisting of a metal rod and being higher than the position of the semiconductor wafer 23 on the wafer fastener 24 are set up on the floor of the outer cylinder 21. When the wafer fastener 24 rotates, the resist which is stretched like thread over the surface of the semiconductor wafer 23 and is suspended toward the internal wall face of the inner cylinder 25, is deposited on the stopper 28. Accordingly, it can be prevented that the resist may be deposited again on the surface of the semiconductor wafer 23 and may be deposited on the wafer fastener 24 and the rotating axis 20 owing to be stretched like thread.