HIGH-SPEED SILVER PLATING SOLUTION

HIGH-SPEED SILVER PLATING SOLUTION

PURPOSE:To obtain a high-speed silver plating soln. preventing the substitution deposition of silver and reducing the loss of silver by adding an aromatic compound having >NH group in the molecule, a silver alkali cyanide and a salt which improves the electric conductivity of a bath and buffers t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MORI YASUO, OOKUBO RIICHI, KASAI SHIYUNICHI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MORI YASUO
OOKUBO RIICHI
KASAI SHIYUNICHI
description PURPOSE:To obtain a high-speed silver plating soln. preventing the substitution deposition of silver and reducing the loss of silver by adding an aromatic compound having >NH group in the molecule, a silver alkali cyanide and a salt which improves the electric conductivity of a bath and buffers the bath at a prescribed pH. CONSTITUTION:This high-speed silver plating soln. contains 20-500mg/l aromatic compound having >NH group in the molecule, a silver alkali cyanide such as KAg(CN)2, and a salt which improves the electric conductivity of the bath and buffers the bath at 7.0-9.0pH. The salt includes K2HPO4. Benzotriazole, 5,6- dimethylbenzotriazole or the like is used as the aromatic compound. An Se compound may be added to the plating soln. so as to improve the luster of a plated film and to enable the formation of a thin plated film having no pinholes. It is desirable that the concn. of the free cyanide in the plating soln. is kept at
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS60159191A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS60159191A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS60159191A3</originalsourceid><addsrcrecordid>eNrjZFDy8HT30A0OcHV1UQj29AlzDVII8HEM8fRzVwj29wkN8fT342FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BwWYGhqaWhpaGjsbEqAEASRAi4A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HIGH-SPEED SILVER PLATING SOLUTION</title><source>esp@cenet</source><creator>MORI YASUO ; OOKUBO RIICHI ; KASAI SHIYUNICHI</creator><creatorcontrib>MORI YASUO ; OOKUBO RIICHI ; KASAI SHIYUNICHI</creatorcontrib><description>PURPOSE:To obtain a high-speed silver plating soln. preventing the substitution deposition of silver and reducing the loss of silver by adding an aromatic compound having &gt;NH group in the molecule, a silver alkali cyanide and a salt which improves the electric conductivity of a bath and buffers the bath at a prescribed pH. CONSTITUTION:This high-speed silver plating soln. contains 20-500mg/l aromatic compound having &gt;NH group in the molecule, a silver alkali cyanide such as KAg(CN)2, and a salt which improves the electric conductivity of the bath and buffers the bath at 7.0-9.0pH. The salt includes K2HPO4. Benzotriazole, 5,6- dimethylbenzotriazole or the like is used as the aromatic compound. An Se compound may be added to the plating soln. so as to improve the luster of a plated film and to enable the formation of a thin plated film having no pinholes. It is desirable that the concn. of the free cyanide in the plating soln. is kept at &lt;=5g/l.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19850820&amp;DB=EPODOC&amp;CC=JP&amp;NR=S60159191A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19850820&amp;DB=EPODOC&amp;CC=JP&amp;NR=S60159191A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORI YASUO</creatorcontrib><creatorcontrib>OOKUBO RIICHI</creatorcontrib><creatorcontrib>KASAI SHIYUNICHI</creatorcontrib><title>HIGH-SPEED SILVER PLATING SOLUTION</title><description>PURPOSE:To obtain a high-speed silver plating soln. preventing the substitution deposition of silver and reducing the loss of silver by adding an aromatic compound having &gt;NH group in the molecule, a silver alkali cyanide and a salt which improves the electric conductivity of a bath and buffers the bath at a prescribed pH. CONSTITUTION:This high-speed silver plating soln. contains 20-500mg/l aromatic compound having &gt;NH group in the molecule, a silver alkali cyanide such as KAg(CN)2, and a salt which improves the electric conductivity of the bath and buffers the bath at 7.0-9.0pH. The salt includes K2HPO4. Benzotriazole, 5,6- dimethylbenzotriazole or the like is used as the aromatic compound. An Se compound may be added to the plating soln. so as to improve the luster of a plated film and to enable the formation of a thin plated film having no pinholes. It is desirable that the concn. of the free cyanide in the plating soln. is kept at &lt;=5g/l.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1985</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDy8HT30A0OcHV1UQj29AlzDVII8HEM8fRzVwj29wkN8fT342FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BwWYGhqaWhpaGjsbEqAEASRAi4A</recordid><startdate>19850820</startdate><enddate>19850820</enddate><creator>MORI YASUO</creator><creator>OOKUBO RIICHI</creator><creator>KASAI SHIYUNICHI</creator><scope>EVB</scope></search><sort><creationdate>19850820</creationdate><title>HIGH-SPEED SILVER PLATING SOLUTION</title><author>MORI YASUO ; OOKUBO RIICHI ; KASAI SHIYUNICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS60159191A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1985</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>MORI YASUO</creatorcontrib><creatorcontrib>OOKUBO RIICHI</creatorcontrib><creatorcontrib>KASAI SHIYUNICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORI YASUO</au><au>OOKUBO RIICHI</au><au>KASAI SHIYUNICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGH-SPEED SILVER PLATING SOLUTION</title><date>1985-08-20</date><risdate>1985</risdate><abstract>PURPOSE:To obtain a high-speed silver plating soln. preventing the substitution deposition of silver and reducing the loss of silver by adding an aromatic compound having &gt;NH group in the molecule, a silver alkali cyanide and a salt which improves the electric conductivity of a bath and buffers the bath at a prescribed pH. CONSTITUTION:This high-speed silver plating soln. contains 20-500mg/l aromatic compound having &gt;NH group in the molecule, a silver alkali cyanide such as KAg(CN)2, and a salt which improves the electric conductivity of the bath and buffers the bath at 7.0-9.0pH. The salt includes K2HPO4. Benzotriazole, 5,6- dimethylbenzotriazole or the like is used as the aromatic compound. An Se compound may be added to the plating soln. so as to improve the luster of a plated film and to enable the formation of a thin plated film having no pinholes. It is desirable that the concn. of the free cyanide in the plating soln. is kept at &lt;=5g/l.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPS60159191A
source esp@cenet
subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title HIGH-SPEED SILVER PLATING SOLUTION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T16%3A49%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORI%20YASUO&rft.date=1985-08-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS60159191A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true