NICKEL POWDER FOR ELECTRICALLY CONDUCTIVE FILLER
PURPOSE:To obtain Ni powder with high electric conductivity for providing electric conductivity to paint for an electromagnetic wave shield by sticking a small amount of Sn to the surface of Ni powder of a proper particle size. CONSTITUTION:SnCl2 is dissolved in diluted hydrochloric acid, and Ni pow...
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| creator | MIURA HIROSHI ISHIDATE TOSHIO KASAI KAZUO |
| description | PURPOSE:To obtain Ni powder with high electric conductivity for providing electric conductivity to paint for an electromagnetic wave shield by sticking a small amount of Sn to the surface of Ni powder of a proper particle size. CONSTITUTION:SnCl2 is dissolved in diluted hydrochloric acid, and Ni powder of 100mum average particle size is put in the soln. and stirred with a glass rod to stick 0.01-10wt% Sn to the surface of the Ni powder. Since no oxide is formed on the surface of the resulting Ni powder, the contact electric resistance of the Ni powder is not increased, so when the Ni powder is added to paint or plastics for an electromagnetic wave shield, an electromagnetic wave shield having superior characteristics can be munufactured. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS60114501A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS60114501A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS60114501A3</originalsourceid><addsrcrecordid>eNrjZDDw83T2dvVRCPAPd3ENUnDzD1Jw9XF1DgnydHb08YlUcPb3cwl1DvEMc1Vw8_TxcQ3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgHBZgaGhiamBoaOxsSoAQA5FyaQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>NICKEL POWDER FOR ELECTRICALLY CONDUCTIVE FILLER</title><source>esp@cenet</source><creator>MIURA HIROSHI ; ISHIDATE TOSHIO ; KASAI KAZUO</creator><creatorcontrib>MIURA HIROSHI ; ISHIDATE TOSHIO ; KASAI KAZUO</creatorcontrib><description>PURPOSE:To obtain Ni powder with high electric conductivity for providing electric conductivity to paint for an electromagnetic wave shield by sticking a small amount of Sn to the surface of Ni powder of a proper particle size. CONSTITUTION:SnCl2 is dissolved in diluted hydrochloric acid, and Ni powder of 100mum average particle size is put in the soln. and stirred with a glass rod to stick 0.01-10wt% Sn to the surface of the Ni powder. Since no oxide is formed on the surface of the resulting Ni powder, the contact electric resistance of the Ni powder is not increased, so when the Ni powder is added to paint or plastics for an electromagnetic wave shield, an electromagnetic wave shield having superior characteristics can be munufactured.</description><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INSULATORS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; POWDER METALLURGY ; PREPARATION OF CARBON BLACK ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING METALLIC POWDER</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850621&DB=EPODOC&CC=JP&NR=S60114501A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850621&DB=EPODOC&CC=JP&NR=S60114501A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIURA HIROSHI</creatorcontrib><creatorcontrib>ISHIDATE TOSHIO</creatorcontrib><creatorcontrib>KASAI KAZUO</creatorcontrib><title>NICKEL POWDER FOR ELECTRICALLY CONDUCTIVE FILLER</title><description>PURPOSE:To obtain Ni powder with high electric conductivity for providing electric conductivity to paint for an electromagnetic wave shield by sticking a small amount of Sn to the surface of Ni powder of a proper particle size. CONSTITUTION:SnCl2 is dissolved in diluted hydrochloric acid, and Ni powder of 100mum average particle size is put in the soln. and stirred with a glass rod to stick 0.01-10wt% Sn to the surface of the Ni powder. Since no oxide is formed on the surface of the resulting Ni powder, the contact electric resistance of the Ni powder is not increased, so when the Ni powder is added to paint or plastics for an electromagnetic wave shield, an electromagnetic wave shield having superior characteristics can be munufactured.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CASTING</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POWDER METALLURGY</subject><subject>PREPARATION OF CARBON BLACK</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1985</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDw83T2dvVRCPAPd3ENUnDzD1Jw9XF1DgnydHb08YlUcPb3cwl1DvEMc1Vw8_TxcQ3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgHBZgaGhiamBoaOxsSoAQA5FyaQ</recordid><startdate>19850621</startdate><enddate>19850621</enddate><creator>MIURA HIROSHI</creator><creator>ISHIDATE TOSHIO</creator><creator>KASAI KAZUO</creator><scope>EVB</scope></search><sort><creationdate>19850621</creationdate><title>NICKEL POWDER FOR ELECTRICALLY CONDUCTIVE FILLER</title><author>MIURA HIROSHI ; ISHIDATE TOSHIO ; KASAI KAZUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS60114501A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1985</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CASTING</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POWDER METALLURGY</topic><topic>PREPARATION OF CARBON BLACK</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>MIURA HIROSHI</creatorcontrib><creatorcontrib>ISHIDATE TOSHIO</creatorcontrib><creatorcontrib>KASAI KAZUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIURA HIROSHI</au><au>ISHIDATE TOSHIO</au><au>KASAI KAZUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>NICKEL POWDER FOR ELECTRICALLY CONDUCTIVE FILLER</title><date>1985-06-21</date><risdate>1985</risdate><abstract>PURPOSE:To obtain Ni powder with high electric conductivity for providing electric conductivity to paint for an electromagnetic wave shield by sticking a small amount of Sn to the surface of Ni powder of a proper particle size. CONSTITUTION:SnCl2 is dissolved in diluted hydrochloric acid, and Ni powder of 100mum average particle size is put in the soln. and stirred with a glass rod to stick 0.01-10wt% Sn to the surface of the Ni powder. Since no oxide is formed on the surface of the resulting Ni powder, the contact electric resistance of the Ni powder is not increased, so when the Ni powder is added to paint or plastics for an electromagnetic wave shield, an electromagnetic wave shield having superior characteristics can be munufactured.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY PREPARATION OF CARBON BLACK PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING METALLIC POWDER |
| title | NICKEL POWDER FOR ELECTRICALLY CONDUCTIVE FILLER |
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