MANUFACTURE OF ULTRASONIC WAVE PROBE
PURPOSE:To manufacture easily an ultrasonic wave probe having a narrow ceramic oscillator by cutting off a matching layer and a thin plate so as not to produce defective contact. CONSTITUTION:The ceramic oscillators 18 having electrodes 15, 16 on both upper and lower surfaces are arranged on a line...
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| description | PURPOSE:To manufacture easily an ultrasonic wave probe having a narrow ceramic oscillator by cutting off a matching layer and a thin plate so as not to produce defective contact. CONSTITUTION:The ceramic oscillators 18 having electrodes 15, 16 on both upper and lower surfaces are arranged on a line by a prescribed interval on an ultrasonic wave absorbing body at first. The thin plate 21 being conductive as a common lead and folded easily is edhered by soldering to a part of the upper electrode 15 and superposed on the electrode 15. An insulating adhesives 22 having a high viscosity so as not to be absorbed into cutting grooves 19, 20 is coated to the side face bonding the thin plate 21 to the absorbing body 14 and the oscillator 18. Further, the thin plate 21 is folded near the end of the oscillator 18 and adhered and fixed to the oscillator 18 and the absorbing body 14. After a sound matching layer 23 is provided closely onto the upper electrode 15, the layer 23 is cut off together with the thin plate 21 at the position of the cut groove 20, allowing to manufacture the ultrasonic wave probe having narrowered oscillator 18. |
| format | Patent |
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CONSTITUTION:The ceramic oscillators 18 having electrodes 15, 16 on both upper and lower surfaces are arranged on a line by a prescribed interval on an ultrasonic wave absorbing body at first. The thin plate 21 being conductive as a common lead and folded easily is edhered by soldering to a part of the upper electrode 15 and superposed on the electrode 15. An insulating adhesives 22 having a high viscosity so as not to be absorbed into cutting grooves 19, 20 is coated to the side face bonding the thin plate 21 to the absorbing body 14 and the oscillator 18. Further, the thin plate 21 is folded near the end of the oscillator 18 and adhered and fixed to the oscillator 18 and the absorbing body 14. After a sound matching layer 23 is provided closely onto the upper electrode 15, the layer 23 is cut off together with the thin plate 21 at the position of the cut groove 20, allowing to manufacture the ultrasonic wave probe having narrowered oscillator 18.</description><language>eng</language><subject>DEAF-AID SETS ; DIAGNOSIS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; FOR PERFORMING MECHANICAL WORK IN GENERAL ; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL ; HUMAN NECESSITIES ; HYGIENE ; IDENTIFICATION ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; MEASURING ; MEDICAL OR VETERINARY SCIENCE ; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY ; PERFORMING OPERATIONS ; PHYSICS ; PUBLIC ADDRESS SYSTEMS ; SURGERY ; TESTING ; TRANSPORTING</subject><creationdate>1984</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19840526&DB=EPODOC&CC=JP&NR=S5991800A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19840526&DB=EPODOC&CC=JP&NR=S5991800A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DOI TOSHIKATSU</creatorcontrib><title>MANUFACTURE OF ULTRASONIC WAVE PROBE</title><description>PURPOSE:To manufacture easily an ultrasonic wave probe having a narrow ceramic oscillator by cutting off a matching layer and a thin plate so as not to produce defective contact. 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After a sound matching layer 23 is provided closely onto the upper electrode 15, the layer 23 is cut off together with the thin plate 21 at the position of the cut groove 20, allowing to manufacture the ultrasonic wave probe having narrowered oscillator 18.</description><subject>DEAF-AID SETS</subject><subject>DIAGNOSIS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>FOR PERFORMING MECHANICAL WORK IN GENERAL</subject><subject>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>IDENTIFICATION</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>MEASURING</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><subject>SURGERY</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1984</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDxdfQLdXN0DgkNclXwd1MI9QkJcgz29_N0Vgh3DHNVCAjyd3LlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgHBppaWhhYGBo7GRCgBAEuMIwA</recordid><startdate>19840526</startdate><enddate>19840526</enddate><creator>DOI TOSHIKATSU</creator><scope>EVB</scope></search><sort><creationdate>19840526</creationdate><title>MANUFACTURE OF ULTRASONIC WAVE PROBE</title><author>DOI TOSHIKATSU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS5991800A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1984</creationdate><topic>DEAF-AID SETS</topic><topic>DIAGNOSIS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>FOR PERFORMING MECHANICAL WORK IN GENERAL</topic><topic>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>IDENTIFICATION</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>MEASURING</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><topic>SURGERY</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>DOI TOSHIKATSU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DOI TOSHIKATSU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF ULTRASONIC WAVE PROBE</title><date>1984-05-26</date><risdate>1984</risdate><abstract>PURPOSE:To manufacture easily an ultrasonic wave probe having a narrow ceramic oscillator by cutting off a matching layer and a thin plate so as not to produce defective contact. CONSTITUTION:The ceramic oscillators 18 having electrodes 15, 16 on both upper and lower surfaces are arranged on a line by a prescribed interval on an ultrasonic wave absorbing body at first. The thin plate 21 being conductive as a common lead and folded easily is edhered by soldering to a part of the upper electrode 15 and superposed on the electrode 15. An insulating adhesives 22 having a high viscosity so as not to be absorbed into cutting grooves 19, 20 is coated to the side face bonding the thin plate 21 to the absorbing body 14 and the oscillator 18. Further, the thin plate 21 is folded near the end of the oscillator 18 and adhered and fixed to the oscillator 18 and the absorbing body 14. After a sound matching layer 23 is provided closely onto the upper electrode 15, the layer 23 is cut off together with the thin plate 21 at the position of the cut groove 20, allowing to manufacture the ultrasonic wave probe having narrowered oscillator 18.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DEAF-AID SETS DIAGNOSIS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL HUMAN NECESSITIES HYGIENE IDENTIFICATION INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MEASURING MEDICAL OR VETERINARY SCIENCE METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PERFORMING OPERATIONS PHYSICS PUBLIC ADDRESS SYSTEMS SURGERY TESTING TRANSPORTING |
| title | MANUFACTURE OF ULTRASONIC WAVE PROBE |
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