METHOD OF MOLDING RESIN ITEM

PURPOSE:To obtain easily a resin molded item of a desired shape without requiring any complicated means and with the loading operation of the resin quite ready, by using a specified mold having a configuration memory alloy embedded therein integrally. CONSTITUTION:The mold 1 having a molding groove...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KONDOU YASUSHI, OBARA HIFUMI, IWASAKI KAZUHISA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain easily a resin molded item of a desired shape without requiring any complicated means and with the loading operation of the resin quite ready, by using a specified mold having a configuration memory alloy embedded therein integrally. CONSTITUTION:The mold 1 having a molding groove 2 is made of a material (e.g. resins, rubbers, etc.) whose softening temperature is relatively high and that can be plactically deformed, the configuration memory alloy (e.g. Ni-Ti alloys, etc.) 3 that has memorized the intended configuration for the intended resin item is integrally embedded in said mold, and when the modling is carried out the mold is straightened, the resin material 4 is loaded into the molding groove 2, and the mold is heated to a prescribed temperature to regain the memorized configuration thereby to obtain the intended item. The mold can be repeatedly employed. The heating is carried out at a temperature 100-900 deg.C at which the resin material is softened and the memory configuration alloy regain the memorized configuration, and if the heating temperature is 500 deg.C, it is preferable to carry out the molding under an atmosphere free of oxygen.