CHEMICAL COPPER PLATING METHOD
PURPOSE:To prevent the preparation of an inferior print base board, in preparing said product, by a method wherein the ion concn. in a chemical copper plating bath is detected and said chemical copper plating bath is succeedingly used to the extent of allowable iron ion concn. CONSTITUTION:A copper...
Gespeichert in:
| Hauptverfasser: | , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MORISHITA YASUSADA KAWAKUBO SHIYOUJI MATSUDA YOUICHI WAJIMA MOTOYO YOSHIMURA TOYOFUSA KAWAMOTO MINEO MURAKAMI KANJI AKABOSHI HARUO |
| description | PURPOSE:To prevent the preparation of an inferior print base board, in preparing said product, by a method wherein the ion concn. in a chemical copper plating bath is detected and said chemical copper plating bath is succeedingly used to the extent of allowable iron ion concn. CONSTITUTION:A copper film is precipitated to a circuit forming part through the use of a resit film by chemical copper plating to form a circuit. In preparing a print base board, the iron ion concn. in a chemical copper plating bath is detected. The plating bath is succeedingly used until the iron ion concn. reaches 2mg/l. The final point in succeedingly using the plating bath is determined by ascertaining said tolerant value to make it possible to prevent the lowering in the quality of a plating film. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS5916960A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS5916960A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS5916960A3</originalsourceid><addsrcrecordid>eNrjZJBz9nD19XR29FFw9g8IcA1SCPBxDPH0c1fwdQ3x8HfhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgHBppaGZpZmBo7GRCgBAG-dITI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CHEMICAL COPPER PLATING METHOD</title><source>esp@cenet</source><creator>MORISHITA YASUSADA ; KAWAKUBO SHIYOUJI ; MATSUDA YOUICHI ; WAJIMA MOTOYO ; YOSHIMURA TOYOFUSA ; KAWAMOTO MINEO ; MURAKAMI KANJI ; AKABOSHI HARUO</creator><creatorcontrib>MORISHITA YASUSADA ; KAWAKUBO SHIYOUJI ; MATSUDA YOUICHI ; WAJIMA MOTOYO ; YOSHIMURA TOYOFUSA ; KAWAMOTO MINEO ; MURAKAMI KANJI ; AKABOSHI HARUO</creatorcontrib><description>PURPOSE:To prevent the preparation of an inferior print base board, in preparing said product, by a method wherein the ion concn. in a chemical copper plating bath is detected and said chemical copper plating bath is succeedingly used to the extent of allowable iron ion concn. CONSTITUTION:A copper film is precipitated to a circuit forming part through the use of a resit film by chemical copper plating to form a circuit. In preparing a print base board, the iron ion concn. in a chemical copper plating bath is detected. The plating bath is succeedingly used until the iron ion concn. reaches 2mg/l. The final point in succeedingly using the plating bath is determined by ascertaining said tolerant value to make it possible to prevent the lowering in the quality of a plating film.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1984</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19840128&DB=EPODOC&CC=JP&NR=S5916960A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19840128&DB=EPODOC&CC=JP&NR=S5916960A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORISHITA YASUSADA</creatorcontrib><creatorcontrib>KAWAKUBO SHIYOUJI</creatorcontrib><creatorcontrib>MATSUDA YOUICHI</creatorcontrib><creatorcontrib>WAJIMA MOTOYO</creatorcontrib><creatorcontrib>YOSHIMURA TOYOFUSA</creatorcontrib><creatorcontrib>KAWAMOTO MINEO</creatorcontrib><creatorcontrib>MURAKAMI KANJI</creatorcontrib><creatorcontrib>AKABOSHI HARUO</creatorcontrib><title>CHEMICAL COPPER PLATING METHOD</title><description>PURPOSE:To prevent the preparation of an inferior print base board, in preparing said product, by a method wherein the ion concn. in a chemical copper plating bath is detected and said chemical copper plating bath is succeedingly used to the extent of allowable iron ion concn. CONSTITUTION:A copper film is precipitated to a circuit forming part through the use of a resit film by chemical copper plating to form a circuit. In preparing a print base board, the iron ion concn. in a chemical copper plating bath is detected. The plating bath is succeedingly used until the iron ion concn. reaches 2mg/l. The final point in succeedingly using the plating bath is determined by ascertaining said tolerant value to make it possible to prevent the lowering in the quality of a plating film.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1984</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBz9nD19XR29FFw9g8IcA1SCPBxDPH0c1fwdQ3x8HfhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgHBppaGZpZmBo7GRCgBAG-dITI</recordid><startdate>19840128</startdate><enddate>19840128</enddate><creator>MORISHITA YASUSADA</creator><creator>KAWAKUBO SHIYOUJI</creator><creator>MATSUDA YOUICHI</creator><creator>WAJIMA MOTOYO</creator><creator>YOSHIMURA TOYOFUSA</creator><creator>KAWAMOTO MINEO</creator><creator>MURAKAMI KANJI</creator><creator>AKABOSHI HARUO</creator><scope>EVB</scope></search><sort><creationdate>19840128</creationdate><title>CHEMICAL COPPER PLATING METHOD</title><author>MORISHITA YASUSADA ; KAWAKUBO SHIYOUJI ; MATSUDA YOUICHI ; WAJIMA MOTOYO ; YOSHIMURA TOYOFUSA ; KAWAMOTO MINEO ; MURAKAMI KANJI ; AKABOSHI HARUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS5916960A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1984</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>MORISHITA YASUSADA</creatorcontrib><creatorcontrib>KAWAKUBO SHIYOUJI</creatorcontrib><creatorcontrib>MATSUDA YOUICHI</creatorcontrib><creatorcontrib>WAJIMA MOTOYO</creatorcontrib><creatorcontrib>YOSHIMURA TOYOFUSA</creatorcontrib><creatorcontrib>KAWAMOTO MINEO</creatorcontrib><creatorcontrib>MURAKAMI KANJI</creatorcontrib><creatorcontrib>AKABOSHI HARUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORISHITA YASUSADA</au><au>KAWAKUBO SHIYOUJI</au><au>MATSUDA YOUICHI</au><au>WAJIMA MOTOYO</au><au>YOSHIMURA TOYOFUSA</au><au>KAWAMOTO MINEO</au><au>MURAKAMI KANJI</au><au>AKABOSHI HARUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHEMICAL COPPER PLATING METHOD</title><date>1984-01-28</date><risdate>1984</risdate><abstract>PURPOSE:To prevent the preparation of an inferior print base board, in preparing said product, by a method wherein the ion concn. in a chemical copper plating bath is detected and said chemical copper plating bath is succeedingly used to the extent of allowable iron ion concn. CONSTITUTION:A copper film is precipitated to a circuit forming part through the use of a resit film by chemical copper plating to form a circuit. In preparing a print base board, the iron ion concn. in a chemical copper plating bath is detected. The plating bath is succeedingly used until the iron ion concn. reaches 2mg/l. The final point in succeedingly using the plating bath is determined by ascertaining said tolerant value to make it possible to prevent the lowering in the quality of a plating film.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPS5916960A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | CHEMICAL COPPER PLATING METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T11%3A43%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORISHITA%20YASUSADA&rft.date=1984-01-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS5916960A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |