ADHESIVE COMPOSITION FOR POLYWOOD
PURPOSE:To obtain titled composition of improved water resistance, with markedly reduced formalin ordor emitting from plywoods, comprising an amino resin and a phenolic resin powder. CONSTITUTION:The objective composition comprising (A) an amino resin selected from urea-formaldehyde resin and melami...
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| creator | MATSUURA TADAYOSHI SUNAGA KEIICHI TAKEBE TOMOFUMI OOTSUKA SHINJIROU |
| description | PURPOSE:To obtain titled composition of improved water resistance, with markedly reduced formalin ordor emitting from plywoods, comprising an amino resin and a phenolic resin powder. CONSTITUTION:The objective composition comprising (A) an amino resin selected from urea-formaldehyde resin and melamine-formaldehyde resin, and (B) a phenolic resin powder (pref. a novolak-type one with a particle size 50-60mu, a free phenol content |
| format | Patent |
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CONSTITUTION:The objective composition comprising (A) an amino resin selected from urea-formaldehyde resin and melamine-formaldehyde resin, and (B) a phenolic resin powder (pref. a novolak-type one with a particle size 50-60mu, a free phenol content <=3wt%, a softening point 95-105 deg.C, or a resol-type one with a softening point 65-75 deg.C, a curing time (at 150 deg.C) 40-120sec). A preferable compounding amount is as follows: (A) 100pts.wt. of an urea-formaldehyde resin, (B) 2-50pts.wt. of novolak-type resin powder, or 2-40pts.wt. of a resol- type one.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830521&DB=EPODOC&CC=JP&NR=S5884876A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830521&DB=EPODOC&CC=JP&NR=S5884876A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUURA TADAYOSHI</creatorcontrib><creatorcontrib>SUNAGA KEIICHI</creatorcontrib><creatorcontrib>TAKEBE TOMOFUMI</creatorcontrib><creatorcontrib>OOTSUKA SHINJIROU</creatorcontrib><title>ADHESIVE COMPOSITION FOR POLYWOOD</title><description>PURPOSE:To obtain titled composition of improved water resistance, with markedly reduced formalin ordor emitting from plywoods, comprising an amino resin and a phenolic resin powder. CONSTITUTION:The objective composition comprising (A) an amino resin selected from urea-formaldehyde resin and melamine-formaldehyde resin, and (B) a phenolic resin powder (pref. a novolak-type one with a particle size 50-60mu, a free phenol content <=3wt%, a softening point 95-105 deg.C, or a resol-type one with a softening point 65-75 deg.C, a curing time (at 150 deg.C) 40-120sec). 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CONSTITUTION:The objective composition comprising (A) an amino resin selected from urea-formaldehyde resin and melamine-formaldehyde resin, and (B) a phenolic resin powder (pref. a novolak-type one with a particle size 50-60mu, a free phenol content <=3wt%, a softening point 95-105 deg.C, or a resol-type one with a softening point 65-75 deg.C, a curing time (at 150 deg.C) 40-120sec). A preferable compounding amount is as follows: (A) 100pts.wt. of an urea-formaldehyde resin, (B) 2-50pts.wt. of novolak-type resin powder, or 2-40pts.wt. of a resol- type one.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION FOR POLYWOOD |
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