MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To obtain a semiconductor device formed with a solder layer on the back surface electrode in less number of steps by enabling to simultaneously performing the step of dividing a molten solder layer formed on the overall area of the back surface of a wafer and the solder layer of the back sur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ITOU SHIYUUZOU, MATSUSHIMA IWAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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