SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PURPOSE:To enable to readily and accurately mount in high density by forming holes at suitable positions of a lead terminal projected from a package. CONSTITUTION:When round holes 3a are opened on a lead 2a projected from a package 1a and the package is clamped to a substrate with screws through ins...

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1. Verfasser:	KUDOU YOSHIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	KUDOU YOSHIMASA
description	PURPOSE:To enable to readily and accurately mount in high density by forming holes at suitable positions of a lead terminal projected from a package. CONSTITUTION:When round holes 3a are opened on a lead 2a projected from a package 1a and the package is clamped to a substrate with screws through insulators and heat sink by utilizing the holes 3a, it can be accurately positioned. Or, holes 3b are opened at the prescribed leads, the mounting is rationalized to match the holes of the substrate, or the end of the lead 2c' of the package 1c' can be inserted into the hole 3c of the lead 2c of the package 1c, two ICs are connected directly, conducting resistance can be reduced, and the mounting density can be improved.
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CONSTITUTION:When round holes 3a are opened on a lead 2a projected from a package 1a and the package is clamped to a substrate with screws through insulators and heat sink by utilizing the holes 3a, it can be accurately positioned. Or, holes 3b are opened at the prescribed leads, the mounting is rationalized to match the holes of the substrate, or the end of the lead 2c' of the package 1c' can be inserted into the hole 3c of the lead 2c of the package 1c, two ICs are connected directly, conducting resistance can be reduced, and the mounting density can be improved.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830921&DB=EPODOC&CC=JP&NR=S58158955A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830921&DB=EPODOC&CC=JP&NR=S58158955A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDOU YOSHIMASA</creatorcontrib><title>SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE</title><description>PURPOSE:To enable to readily and accurately mount in high density by forming holes at suitable positions of a lead terminal projected from a package. CONSTITUTION:When round holes 3a are opened on a lead 2a projected from a package 1a and the package is clamped to a substrate with screws through insulators and heat sink by utilizing the holes 3a, it can be accurately positioned. Or, holes 3b are opened at the prescribed leads, the mounting is rationalized to match the holes of the substrate, or the end of the lead 2c' of the package 1c' can be inserted into the hole 3c of the lead 2c of the package 1c, two ICs are connected directly, conducting resistance can be reduced, and the mounting density can be improved.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1983</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAPdvX1dPb3cwl1DvEPUvD0C3F1D3IMcXVRcPYMcg71DFFwcQ3zdHblYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgHBphaGphaWpqaOxsSoAQAGcyRr</recordid><startdate>19830921</startdate><enddate>19830921</enddate><creator>KUDOU YOSHIMASA</creator><scope>EVB</scope></search><sort><creationdate>19830921</creationdate><title>SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE</title><author>KUDOU YOSHIMASA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS58158955A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1983</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUDOU YOSHIMASA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUDOU YOSHIMASA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE</title><date>1983-09-21</date><risdate>1983</risdate><abstract>PURPOSE:To enable to readily and accurately mount in high density by forming holes at suitable positions of a lead terminal projected from a package. CONSTITUTION:When round holes 3a are opened on a lead 2a projected from a package 1a and the package is clamped to a substrate with screws through insulators and heat sink by utilizing the holes 3a, it can be accurately positioned. Or, holes 3b are opened at the prescribed leads, the mounting is rationalized to match the holes of the substrate, or the end of the lead 2c' of the package 1c' can be inserted into the hole 3c of the lead 2c of the package 1c, two ICs are connected directly, conducting resistance can be reduced, and the mounting density can be improved.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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