MANUFACTURE OF SOLID STATE IMAGE PICKUP DEVICE
PURPOSE:To minimize thermal strain applied to a translucent glass plate, and to obtain a highly reliable solid image pickup device, by previously depositing a soldering material on at least either one of a metallic frame body of a package side or that on a cap side. CONSTITUTION:On a metallic frame...
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| creator | MIYATA KIYOYUKI KOSEMURA HIROSHI FURUNAGA ATSUKI FUJITA TSUTOMU KIYONO MASAMI IWATA YOSHIO |
| description | PURPOSE:To minimize thermal strain applied to a translucent glass plate, and to obtain a highly reliable solid image pickup device, by previously depositing a soldering material on at least either one of a metallic frame body of a package side or that on a cap side. CONSTITUTION:On a metallic frame body 11 on the side of a package 1, an Au/ Sn soldering material 12 is deposited previously. Consequently, metallic frame bodies 9 and 11 are seam-welded together with a small welding current, and the heating value during the welding is reduced to reduce residual thermal strain to a transparent glass plate 7. Further, the soldering material 12 is stuck previously on the metallic frame body 11 on the package 1 to eliminate a splash of the soldering material 12 completely during the welding to the metallic frame 9 on the side of a cap 10. Further, the sticking of black stains, etc., on the internal surface of the glass plate 7 or on the surface of a photodetecting element 5 is prevented securely and completely to perform stable welding operation. |
| format | Patent |
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CONSTITUTION:On a metallic frame body 11 on the side of a package 1, an Au/ Sn soldering material 12 is deposited previously. Consequently, metallic frame bodies 9 and 11 are seam-welded together with a small welding current, and the heating value during the welding is reduced to reduce residual thermal strain to a transparent glass plate 7. Further, the soldering material 12 is stuck previously on the metallic frame body 11 on the package 1 to eliminate a splash of the soldering material 12 completely during the welding to the metallic frame 9 on the side of a cap 10. Further, the sticking of black stains, etc., on the internal surface of the glass plate 7 or on the surface of a photodetecting element 5 is prevented securely and completely to perform stable welding operation.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
| title | MANUFACTURE OF SOLID STATE IMAGE PICKUP DEVICE |
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