CUTTING METHOD BY LASER

PURPOSE:To cut a plate without any defect at a constant cutting width by increasing the depth of a groove while maintaining the balance between the rate of formation of the melt to be removed by cutting and the pressure of a cutting gas and overlapping and cutting the groove part after penetration o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JINBOU RIYUUTAROU, IKEMOTO NORIO, UNNO TOMIO, TAKAHASHI SHIGERU
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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