LEAD-OUT STRUCTURE OF LEAD WIRE IN POLYMER FILM PACKAGE

PURPOSE:To enable to lead out the lead wire to the outside from the circuit part hermetically sealed in a package which is airtightly maintained by a method wherein a thin metal film is formed on the inner and outer surfaces of a polymer film, and at the same time, a junction type conductive materia...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKAHASHI NARIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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