WASHING OF MASK OR THE LIKE IN PHOTOETCHING PROCESS

PURPOSE:To remove fine dust which can not be observed by eyes from a mask or a wafer completely by passing the mask or the wafer through electrostatic field region in a transfer region of the mask or the wafer. CONSTITUTION:A wafer 7 is supplied on a conveyer 2 by a wafer feeder 1 and, afer being tr...

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Bibliographische Detailangaben
Hauptverfasser:	FURUGUCHI SHIGEO, ISHIDA HIDEKUNI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To remove fine dust which can not be observed by eyes from a mask or a wafer completely by passing the mask or the wafer through electrostatic field region in a transfer region of the mask or the wafer. CONSTITUTION:A wafer 7 is supplied on a conveyer 2 by a wafer feeder 1 and, afer being transferred by the converyer 2, is set on an elevator 3. On the other hand, a mask 8 is positioned between two electrodes 9 and 10 in a mask dust collector 6 where the dust on the surface of the mask 8 is absorbed and removed. Then the mask is transferred to an exposer 4 by a transfer equipment 5 and set to the exposer 4. Then the elevator 3 goes up and the wafer 7 on the elevator 3 is made stick closely to the surface of the mask 8.