METHOD OF SEALING STRUCTURAL PARTS
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creator | KAWAMOTO HIROSHI NAKAYAMA TAKEHIRO OONO HIROKAZU |
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC SWITCHES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; EMERGENCY PROTECTIVE DEVICES ; INDUCTANCES ; MAGNETS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RELAYS ; RESISTORS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; SELECTORS ; SEMICONDUCTOR DEVICES ; TRANSFORMERS</subject><creationdate>1977</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19770509&DB=EPODOC&CC=JP&NR=S5256358A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19770509&DB=EPODOC&CC=JP&NR=S5256358A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWAMOTO HIROSHI</creatorcontrib><creatorcontrib>NAKAYAMA TAKEHIRO</creatorcontrib><creatorcontrib>OONO HIROKAZU</creatorcontrib><title>METHOD OF SEALING STRUCTURAL PARTS</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SWITCHES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>EMERGENCY PROTECTIVE DEVICES</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>RELAYS</subject><subject>RESISTORS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>SELECTORS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1977</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDydQ3x8HdR8HdTCHZ19PH0c1cIDgkKdQ4JDXL0UQhwDAoJ5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BwaZGpmbGphaOxkQoAQAGniJ_</recordid><startdate>19770509</startdate><enddate>19770509</enddate><creator>KAWAMOTO HIROSHI</creator><creator>NAKAYAMA TAKEHIRO</creator><creator>OONO HIROKAZU</creator><scope>EVB</scope></search><sort><creationdate>19770509</creationdate><title>METHOD OF SEALING STRUCTURAL PARTS</title><author>KAWAMOTO HIROSHI ; 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subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC SWITCHES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE DEVICES INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RELAYS RESISTORS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SELECTORS SEMICONDUCTOR DEVICES TRANSFORMERS |
title | METHOD OF SEALING STRUCTURAL PARTS |
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