SEMICONDUCTOR DEVICE

PURPOSE:To reduce the thermal resistance between the bump electrodes and external electrodes and to improve the electrical characteristics by placing a metal plate between the bump electrode and external electrode.

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Bibliographische Detailangaben
Hauptverfasser:	SEKINE MASAHIRO, OONO OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To reduce the thermal resistance between the bump electrodes and external electrodes and to improve the electrical characteristics by placing a metal plate between the bump electrode and external electrode.