HEAT RESISTANT HOLDING CONTAINER EMPLOYING POLYIMIDE RESIN CRYSTALLIZED IN MOLD
PROBLEM TO BE SOLVED: To attain a holding container for processing wafer durable against higher temperature by employing a crystalline polyimide resin having a specific repeating structural unit and a specified logarithmic viscosity. SOLUTION: A crystalline polyimide resin having a repeating structu...
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| creator | YOSHIDA IKUNORI YANAGIHARA KAYAKO YOSHIMURA MASAJI |
| description | PROBLEM TO BE SOLVED: To attain a holding container for processing wafer durable against higher temperature by employing a crystalline polyimide resin having a specific repeating structural unit and a specified logarithmic viscosity. SOLUTION: A crystalline polyimide resin having a repeating structural unit represented by a formula and a logarithmic viscosity in the range of 0.1-3.0 dl/g is employed. A container provided with a stirrer, a circulation cooler and a nitrogen introduction tube is loaded with a given quantity of 3,4'- diaminodiphenyl ether, 3,3',4,4'-biphenyl tetracarboxylic acid dianhydride, phthalic anhydride, m-cresol and heat up to 200 deg.C, for example, while being stirred under nitrogen atmosphere. Jpon finishing reaction of four hours, it is cooled down to room temperature and toluene is loaded before polyimide powder is filtered. The logarithmic viscosity is measured at 35 deg.C after 0.50g of polyimide powder is thermally dissolved into 100 ml of mixture solution of p-chlorophenol/ phenol (weight ratio 9/1). |
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SOLUTION: A crystalline polyimide resin having a repeating structural unit represented by a formula and a logarithmic viscosity in the range of 0.1-3.0 dl/g is employed. A container provided with a stirrer, a circulation cooler and a nitrogen introduction tube is loaded with a given quantity of 3,4'- diaminodiphenyl ether, 3,3',4,4'-biphenyl tetracarboxylic acid dianhydride, phthalic anhydride, m-cresol and heat up to 200 deg.C, for example, while being stirred under nitrogen atmosphere. Jpon finishing reaction of four hours, it is cooled down to room temperature and toluene is loaded before polyimide powder is filtered. The logarithmic viscosity is measured at 35 deg.C after 0.50g of polyimide powder is thermally dissolved into 100 ml of mixture solution of p-chlorophenol/ phenol (weight ratio 9/1).</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | HEAT RESISTANT HOLDING CONTAINER EMPLOYING POLYIMIDE RESIN CRYSTALLIZED IN MOLD |
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