PROCESSING DEVICE AND PROCESSING METHOD

PROBLEM TO BE SOLVED: To eliminate the alkaline component in the atmosphere of a processing system, which is provided with a device for liquid treatment and heat treatment of a wafer by using pure wafer and to suppress microbes generation in the pure wafer. SOLUTION: Lower air in a down flow formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KITANO JUNICHI, KATANO TAKAYUKI, AKUMOTO MASAMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, ORSURGICAL ARTICLES CHEMISTRY DISINFECTION, STERILISATION, OR DEODORISATION OF AIR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICALARTICLES MEDICAL OR VETERINARY SCIENCE METALLURGY METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS INGENERAL SEMICONDUCTOR DEVICES TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!