LASER PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a laser processing device which enables to make a constitution easy and simplifies an actual optical axis adjusting work by eliminating a constraint about the size around the space adjusting mirror. The device is constituted to make the beam space of the divided lase...

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Hauptverfasser: SUGIHARA YASUMASA, OGINO SHUJI, IMAMURA YUJI, TEJIMA WATARU
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creator SUGIHARA YASUMASA
OGINO SHUJI
IMAMURA YUJI
TEJIMA WATARU
description PROBLEM TO BE SOLVED: To provide a laser processing device which enables to make a constitution easy and simplifies an actual optical axis adjusting work by eliminating a constraint about the size around the space adjusting mirror. The device is constituted to make the beam space of the divided laser beam wide, and to make the beam space to be a desired one when the beam enters the slit. SOLUTION: A beam space changing means 8 is installed on the optical path along which each laser beam reflected by total reflection mirrors 4a-4d enters a slit 9. In this case, the beam space changing means 8 is the so-called afocal optical system and reduces the ray bundle width of the incident ray bundle. It is also functioning to narrow the beam space without changing a level of convergence, divergence or the parallelism between the beams.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH115186A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH115186A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH115186A3</originalsourceid><addsrcrecordid>eNrjZBD3cQx2DVIICPJ3dg0O9vRzV3BxDfN0duVhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfFeAR6GhqaGFmaOxoRVAABgxx7M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LASER PROCESSING DEVICE</title><source>esp@cenet</source><creator>SUGIHARA YASUMASA ; OGINO SHUJI ; IMAMURA YUJI ; TEJIMA WATARU</creator><creatorcontrib>SUGIHARA YASUMASA ; OGINO SHUJI ; IMAMURA YUJI ; TEJIMA WATARU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a laser processing device which enables to make a constitution easy and simplifies an actual optical axis adjusting work by eliminating a constraint about the size around the space adjusting mirror. The device is constituted to make the beam space of the divided laser beam wide, and to make the beam space to be a desired one when the beam enters the slit. SOLUTION: A beam space changing means 8 is installed on the optical path along which each laser beam reflected by total reflection mirrors 4a-4d enters a slit 9. In this case, the beam space changing means 8 is the so-called afocal optical system and reduces the ray bundle width of the incident ray bundle. It is also functioning to narrow the beam space without changing a level of convergence, divergence or the parallelism between the beams.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DEVICES USING STIMULATED EMISSION ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PERFORMING OPERATIONS ; PHYSICS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19990112&amp;DB=EPODOC&amp;CC=JP&amp;NR=H115186A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19990112&amp;DB=EPODOC&amp;CC=JP&amp;NR=H115186A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGIHARA YASUMASA</creatorcontrib><creatorcontrib>OGINO SHUJI</creatorcontrib><creatorcontrib>IMAMURA YUJI</creatorcontrib><creatorcontrib>TEJIMA WATARU</creatorcontrib><title>LASER PROCESSING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a laser processing device which enables to make a constitution easy and simplifies an actual optical axis adjusting work by eliminating a constraint about the size around the space adjusting mirror. The device is constituted to make the beam space of the divided laser beam wide, and to make the beam space to be a desired one when the beam enters the slit. SOLUTION: A beam space changing means 8 is installed on the optical path along which each laser beam reflected by total reflection mirrors 4a-4d enters a slit 9. In this case, the beam space changing means 8 is the so-called afocal optical system and reduces the ray bundle width of the incident ray bundle. It is also functioning to narrow the beam space without changing a level of convergence, divergence or the parallelism between the beams.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3cQx2DVIICPJ3dg0O9vRzV3BxDfN0duVhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfFeAR6GhqaGFmaOxoRVAABgxx7M</recordid><startdate>19990112</startdate><enddate>19990112</enddate><creator>SUGIHARA YASUMASA</creator><creator>OGINO SHUJI</creator><creator>IMAMURA YUJI</creator><creator>TEJIMA WATARU</creator><scope>EVB</scope></search><sort><creationdate>19990112</creationdate><title>LASER PROCESSING DEVICE</title><author>SUGIHARA YASUMASA ; OGINO SHUJI ; IMAMURA YUJI ; TEJIMA WATARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH115186A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGIHARA YASUMASA</creatorcontrib><creatorcontrib>OGINO SHUJI</creatorcontrib><creatorcontrib>IMAMURA YUJI</creatorcontrib><creatorcontrib>TEJIMA WATARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGIHARA YASUMASA</au><au>OGINO SHUJI</au><au>IMAMURA YUJI</au><au>TEJIMA WATARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING DEVICE</title><date>1999-01-12</date><risdate>1999</risdate><abstract>PROBLEM TO BE SOLVED: To provide a laser processing device which enables to make a constitution easy and simplifies an actual optical axis adjusting work by eliminating a constraint about the size around the space adjusting mirror. The device is constituted to make the beam space of the divided laser beam wide, and to make the beam space to be a desired one when the beam enters the slit. SOLUTION: A beam space changing means 8 is installed on the optical path along which each laser beam reflected by total reflection mirrors 4a-4d enters a slit 9. In this case, the beam space changing means 8 is the so-called afocal optical system and reduces the ray bundle width of the incident ray bundle. It is also functioning to narrow the beam space without changing a level of convergence, divergence or the parallelism between the beams.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DEVICES USING STIMULATED EMISSION
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title LASER PROCESSING DEVICE
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