LASER PROCESSING METHOD OF FILM
PROBLEM TO BE SOLVED: To provide the laser processing method of the film which has shortened the processing hour and improved the work efficiency. SOLUTION: In the laser processing method, a laser beam scanns and irradiates a sheet 3' wherein an opening part 7 having a hole part 6 and a non-ope...
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| creator | TSUKAMOTO YASUO |
| description | PROBLEM TO BE SOLVED: To provide the laser processing method of the film which has shortened the processing hour and improved the work efficiency. SOLUTION: In the laser processing method, a laser beam scanns and irradiates a sheet 3' wherein an opening part 7 having a hole part 6 and a non-opening part 8 not having a hole part 6 are arranged by turns. Holes are thereby formed on a film 1 corresponding to the hole part 6. In this case, the second laser beam scanning speed against the non-opening part 8 is set faster than the given speed of the first laser beam scanning against the opening part 7. Shortening of the laser processing hour and the improvement of the work efficiency can be thus achieved. |
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SOLUTION: In the laser processing method, a laser beam scanns and irradiates a sheet 3' wherein an opening part 7 having a hole part 6 and a non-opening part 8 not having a hole part 6 are arranged by turns. Holes are thereby formed on a film 1 corresponding to the hole part 6. In this case, the second laser beam scanning speed against the non-opening part 8 is set faster than the given speed of the first laser beam scanning against the opening part 7. Shortening of the laser processing hour and the improvement of the work efficiency can be thus achieved.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990209&DB=EPODOC&CC=JP&NR=H1133762A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990209&DB=EPODOC&CC=JP&NR=H1133762A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUKAMOTO YASUO</creatorcontrib><title>LASER PROCESSING METHOD OF FILM</title><description>PROBLEM TO BE SOLVED: To provide the laser processing method of the film which has shortened the processing hour and improved the work efficiency. SOLUTION: In the laser processing method, a laser beam scanns and irradiates a sheet 3' wherein an opening part 7 having a hole part 6 and a non-opening part 8 not having a hole part 6 are arranged by turns. Holes are thereby formed on a film 1 corresponding to the hole part 6. In this case, the second laser beam scanning speed against the non-opening part 8 is set faster than the given speed of the first laser beam scanning against the opening part 7. Shortening of the laser processing hour and the improvement of the work efficiency can be thus achieved.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD3cQx2DVIICPJ3dg0O9vRzV_B1DfHwd1Hwd1Nw8_Tx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BHoaGxsbmZkaOxkQoAQCNUCFG</recordid><startdate>19990209</startdate><enddate>19990209</enddate><creator>TSUKAMOTO YASUO</creator><scope>EVB</scope></search><sort><creationdate>19990209</creationdate><title>LASER PROCESSING METHOD OF FILM</title><author>TSUKAMOTO YASUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH1133762A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUKAMOTO YASUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUKAMOTO YASUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING METHOD OF FILM</title><date>1999-02-09</date><risdate>1999</risdate><abstract>PROBLEM TO BE SOLVED: To provide the laser processing method of the film which has shortened the processing hour and improved the work efficiency. SOLUTION: In the laser processing method, a laser beam scanns and irradiates a sheet 3' wherein an opening part 7 having a hole part 6 and a non-opening part 8 not having a hole part 6 are arranged by turns. Holes are thereby formed on a film 1 corresponding to the hole part 6. In this case, the second laser beam scanning speed against the non-opening part 8 is set faster than the given speed of the first laser beam scanning against the opening part 7. Shortening of the laser processing hour and the improvement of the work efficiency can be thus achieved.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER PROCESSING METHOD OF FILM |
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