METHOD FOR ADHERING PARTICLE TO SUBSTRATE AND DEVICE THEREOF

PROBLEM TO BE SOLVED: To develop an effective method for removing excess solder particles by loading the solder particles on a semiconductor substrate. SOLUTION: This method is for loading particles 12 and 16 on a substrate 14. Adhesive coating is applied to both surfaces of the substrate 14, and pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GREGORY B HOTCHKISS, KURT P WACHITORAA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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