PROCESSING METHOD AND DEVICE THEREOF, AND SEMICONDUCTOR PRODUCTION LINE AND TRANSFER METHOD OF PROCESSED SUBSTRATE THEREOF

PROBLEM TO BE SOLVED: To provide a processing method and a device thereof, a semiconductor production line and a processed substrate transfer method thereof, wherein a tact time is shortened, and a throughput is improved in a mixed flow production line system where substrates such as wafers are mixedly manufactured. SOLUTION: A processing method, a device and a semiconductor production line have a constitution, where substrates kept in a carrier stored in a processed substrate transfer device (EFEM) are fed into a manufacturing equipment(EQ) equipped with a process treatment means (PM), in accordance with various kinds of substrate feed rules on the basis of data on one or more carriers which are stored in the processed substrate transfer device (EFEM) for keeping the processed substrates and other data on the substrates, the substrates fed to the manufacturing equipment(EQ) are processed by the processing means(PM).