METHOD FOR HANDLING MATERIAL TO BE TREATED AND EQUIPMENT THEREFOR

PROBLEM TO BE SOLVED: To provide a method for handling materials to be treated and the equipment therefor which are capable of aligning the materials to be treated and efficiently loading the materials to be treated on a holding plate or the like to reduce costs. SOLUTION: A plurality of aligning ho...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAGAWA TADAHIRO, TATSUKI SHIZUMARO, FUKUDA MASATO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for handling materials to be treated and the equipment therefor which are capable of aligning the materials to be treated and efficiently loading the materials to be treated on a holding plate or the like to reduce costs. SOLUTION: A plurality of aligning holes 2 for fitting materials to be treated are formed in a given pattern in an endless belt 3. The materials to be treated are supplied to given positions on the endless belt 3. The materials to be treated are fitted to the aligning holes 2 for alignment. The endless belt 3 transports the materials to be treated fitted to the aligning holes 2 as far as a transferring and mounting part 11 used for the materials to be treated and for transferring the materials to be treated. The materials to be treated fitted to the aligning holes 2 are then transferred and mounted.