OPTICAL MODULE AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To mount a surface incidence type photodiode on a silicon-made V-groove substrate nearby a fiber end without using any other component. SOLUTION: A U groove having oblique surfaces at its edges is formed crossing a V groove at right angles, electrodes 14 for connection are form...

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Hauptverfasser: KUROGUCHI KATSUMI, SASAKI HIROYASU
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creator KUROGUCHI KATSUMI
SASAKI HIROYASU
description PROBLEM TO BE SOLVED: To mount a surface incidence type photodiode on a silicon-made V-groove substrate nearby a fiber end without using any other component. SOLUTION: A U groove having oblique surfaces at its edges is formed crossing a V groove at right angles, electrodes 14 for connection are formed on the top surface of the substrate 10 from an oblique surface, and the photodiode 20 fitted with solder bumps 21 is inserted into the U groove 13 and fixed by heating to obtain the optical module. The sum of the height of the solder bumps 21 and the thickness of the photodiode 20 is larger than the width of the U groove 13 and the electrodes 13 at the oblique surface part of the U groove 13 are tapered on the deep side. Consequently, the optical module having the surface incidence type photodiode mounted on the V-groove substrate without using any other component is obtained to improve the economy.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH11218646A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH11218646A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH11218646A3</originalsourceid><addsrcrecordid>eNrjZFDyDwjxdHb0UfD1dwn1cVVw9HNR8AwJVvB19At1c3QOCQ1y5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHoaGRoYWZiZmjsbEqAEANLAilQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OPTICAL MODULE AND ITS MANUFACTURE</title><source>esp@cenet</source><creator>KUROGUCHI KATSUMI ; SASAKI HIROYASU</creator><creatorcontrib>KUROGUCHI KATSUMI ; SASAKI HIROYASU</creatorcontrib><description>PROBLEM TO BE SOLVED: To mount a surface incidence type photodiode on a silicon-made V-groove substrate nearby a fiber end without using any other component. SOLUTION: A U groove having oblique surfaces at its edges is formed crossing a V groove at right angles, electrodes 14 for connection are formed on the top surface of the substrate 10 from an oblique surface, and the photodiode 20 fitted with solder bumps 21 is inserted into the U groove 13 and fixed by heating to obtain the optical module. The sum of the height of the solder bumps 21 and the thickness of the photodiode 20 is larger than the width of the U groove 13 and the electrodes 13 at the oblique surface part of the U groove 13 are tapered on the deep side. Consequently, the optical module having the surface incidence type photodiode mounted on the V-groove substrate without using any other component is obtained to improve the economy.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19990810&amp;DB=EPODOC&amp;CC=JP&amp;NR=H11218646A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19990810&amp;DB=EPODOC&amp;CC=JP&amp;NR=H11218646A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUROGUCHI KATSUMI</creatorcontrib><creatorcontrib>SASAKI HIROYASU</creatorcontrib><title>OPTICAL MODULE AND ITS MANUFACTURE</title><description>PROBLEM TO BE SOLVED: To mount a surface incidence type photodiode on a silicon-made V-groove substrate nearby a fiber end without using any other component. SOLUTION: A U groove having oblique surfaces at its edges is formed crossing a V groove at right angles, electrodes 14 for connection are formed on the top surface of the substrate 10 from an oblique surface, and the photodiode 20 fitted with solder bumps 21 is inserted into the U groove 13 and fixed by heating to obtain the optical module. The sum of the height of the solder bumps 21 and the thickness of the photodiode 20 is larger than the width of the U groove 13 and the electrodes 13 at the oblique surface part of the U groove 13 are tapered on the deep side. Consequently, the optical module having the surface incidence type photodiode mounted on the V-groove substrate without using any other component is obtained to improve the economy.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDyDwjxdHb0UfD1dwn1cVVw9HNR8AwJVvB19At1c3QOCQ1y5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHoaGRoYWZiZmjsbEqAEANLAilQ</recordid><startdate>19990810</startdate><enddate>19990810</enddate><creator>KUROGUCHI KATSUMI</creator><creator>SASAKI HIROYASU</creator><scope>EVB</scope></search><sort><creationdate>19990810</creationdate><title>OPTICAL MODULE AND ITS MANUFACTURE</title><author>KUROGUCHI KATSUMI ; SASAKI HIROYASU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH11218646A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUROGUCHI KATSUMI</creatorcontrib><creatorcontrib>SASAKI HIROYASU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUROGUCHI KATSUMI</au><au>SASAKI HIROYASU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL MODULE AND ITS MANUFACTURE</title><date>1999-08-10</date><risdate>1999</risdate><abstract>PROBLEM TO BE SOLVED: To mount a surface incidence type photodiode on a silicon-made V-groove substrate nearby a fiber end without using any other component. SOLUTION: A U groove having oblique surfaces at its edges is formed crossing a V groove at right angles, electrodes 14 for connection are formed on the top surface of the substrate 10 from an oblique surface, and the photodiode 20 fitted with solder bumps 21 is inserted into the U groove 13 and fixed by heating to obtain the optical module. The sum of the height of the solder bumps 21 and the thickness of the photodiode 20 is larger than the width of the U groove 13 and the electrodes 13 at the oblique surface part of the U groove 13 are tapered on the deep side. Consequently, the optical module having the surface incidence type photodiode mounted on the V-groove substrate without using any other component is obtained to improve the economy.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
title OPTICAL MODULE AND ITS MANUFACTURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T06%3A42%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUROGUCHI%20KATSUMI&rft.date=1999-08-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH11218646A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true