PHENOLIC RESIN COMPOSITION
PROBLEM TO BE SOLVED: To obtain the subject composition maintaining the original characteristics of a phenolic resin, such as heat resistance, improved in balance between the flowability of the composition on its molding and the hardening rate of the composition after charged into a mold, and useful...
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creator | SHINDO YOSHIYUKI TANAKA KOZO URAGAMI TATSUNOBU TAKUMA HIROSUKE TAJIMA TAKUO |
description | PROBLEM TO BE SOLVED: To obtain the subject composition maintaining the original characteristics of a phenolic resin, such as heat resistance, improved in balance between the flowability of the composition on its molding and the hardening rate of the composition after charged into a mold, and useful for a transfer molding method, etc., by including a specific phenolic resin and a small amount of a specific compound. SOLUTION: This phenolic resin composition comprises (A) 95-99.8 wt.% of a phenolic resin (e.g. a phenolaralkyl resin of formula II) represented by formula I [R1 is H, a halogen, etc.; is a benzene ring; (n) is 0-100], having sulfate groups extracted with 10 fold-volume of 95±5 deg.C water in amount of |
format | Patent |
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SOLUTION: This phenolic resin composition comprises (A) 95-99.8 wt.% of a phenolic resin (e.g. a phenolaralkyl resin of formula II) represented by formula I [R1 is H, a halogen, etc.; is a benzene ring; (n) is 0-100], having sulfate groups extracted with 10 fold-volume of 95±5 deg.C water in amount of <=20 ppm, and further having a number-average mol.wt. of 600-3,000 and a weight-average mol.wt. of 1,000-20,000, and (B) 0.2-5 wt.% of a compound such as a para-toluene sulfonic acid of formula III (R2 is H or an alkyl; Ar1 is phenyl or naphthyl; R3 is H, methyl, etc.), and is obtained, e.g. by dissolving the component B in the component A melted at 80-130 deg.C.</description><edition>6</edition><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990126&DB=EPODOC&CC=JP&NR=H1121417A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990126&DB=EPODOC&CC=JP&NR=H1121417A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHINDO YOSHIYUKI</creatorcontrib><creatorcontrib>TANAKA KOZO</creatorcontrib><creatorcontrib>URAGAMI TATSUNOBU</creatorcontrib><creatorcontrib>TAKUMA HIROSUKE</creatorcontrib><creatorcontrib>TAJIMA TAKUO</creatorcontrib><title>PHENOLIC RESIN COMPOSITION</title><description>PROBLEM TO BE SOLVED: To obtain the subject composition maintaining the original characteristics of a phenolic resin, such as heat resistance, improved in balance between the flowability of the composition on its molding and the hardening rate of the composition after charged into a mold, and useful for a transfer molding method, etc., by including a specific phenolic resin and a small amount of a specific compound. SOLUTION: This phenolic resin composition comprises (A) 95-99.8 wt.% of a phenolic resin (e.g. a phenolaralkyl resin of formula II) represented by formula I [R1 is H, a halogen, etc.; is a benzene ring; (n) is 0-100], having sulfate groups extracted with 10 fold-volume of 95±5 deg.C water in amount of <=20 ppm, and further having a number-average mol.wt. of 600-3,000 and a weight-average mol.wt. of 1,000-20,000, and (B) 0.2-5 wt.% of a compound such as a para-toluene sulfonic acid of formula III (R2 is H or an alkyl; Ar1 is phenyl or naphthyl; R3 is H, methyl, etc.), and is obtained, e.g. by dissolving the component B in the component A melted at 80-130 deg.C.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAK8HD18_fxdFYIcg329FNw9vcN8A_2DPH09-NhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR6GhkaGJobmjsZEKAEACH0gKg</recordid><startdate>19990126</startdate><enddate>19990126</enddate><creator>SHINDO YOSHIYUKI</creator><creator>TANAKA KOZO</creator><creator>URAGAMI TATSUNOBU</creator><creator>TAKUMA HIROSUKE</creator><creator>TAJIMA TAKUO</creator><scope>EVB</scope></search><sort><creationdate>19990126</creationdate><title>PHENOLIC RESIN COMPOSITION</title><author>SHINDO YOSHIYUKI ; TANAKA KOZO ; URAGAMI TATSUNOBU ; TAKUMA HIROSUKE ; TAJIMA TAKUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH1121417A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHINDO YOSHIYUKI</creatorcontrib><creatorcontrib>TANAKA KOZO</creatorcontrib><creatorcontrib>URAGAMI TATSUNOBU</creatorcontrib><creatorcontrib>TAKUMA HIROSUKE</creatorcontrib><creatorcontrib>TAJIMA TAKUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHINDO YOSHIYUKI</au><au>TANAKA KOZO</au><au>URAGAMI TATSUNOBU</au><au>TAKUMA HIROSUKE</au><au>TAJIMA TAKUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHENOLIC RESIN COMPOSITION</title><date>1999-01-26</date><risdate>1999</risdate><abstract>PROBLEM TO BE SOLVED: To obtain the subject composition maintaining the original characteristics of a phenolic resin, such as heat resistance, improved in balance between the flowability of the composition on its molding and the hardening rate of the composition after charged into a mold, and useful for a transfer molding method, etc., by including a specific phenolic resin and a small amount of a specific compound. SOLUTION: This phenolic resin composition comprises (A) 95-99.8 wt.% of a phenolic resin (e.g. a phenolaralkyl resin of formula II) represented by formula I [R1 is H, a halogen, etc.; is a benzene ring; (n) is 0-100], having sulfate groups extracted with 10 fold-volume of 95±5 deg.C water in amount of <=20 ppm, and further having a number-average mol.wt. of 600-3,000 and a weight-average mol.wt. of 1,000-20,000, and (B) 0.2-5 wt.% of a compound such as a para-toluene sulfonic acid of formula III (R2 is H or an alkyl; Ar1 is phenyl or naphthyl; R3 is H, methyl, etc.), and is obtained, e.g. by dissolving the component B in the component A melted at 80-130 deg.C.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | PHENOLIC RESIN COMPOSITION |
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