COOLING DEVICE FOR ELECTRONIC COMPUTER
PROBLEM TO BE SOLVED: To cool the components of a host unit in slim chassis design by connecting a duct between a 1st air vent and a processor and installing a fan between the 1st air vent and processor. SOLUTION: In a chassis 300, the dust 302 having a 1st opening connected to the 1st air vent 316...
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| creator | ARTURO MEUNIOTTO SAN FUN KIM RALPH ROBERT REIN |
| description | PROBLEM TO BE SOLVED: To cool the components of a host unit in slim chassis design by connecting a duct between a 1st air vent and a processor and installing a fan between the 1st air vent and processor. SOLUTION: In a chassis 300, the dust 302 having a 1st opening connected to the 1st air vent 316 and a 2nd opening for the CPU 310 is formed. The 2nd opening of the duct 302 has a CPU storage part 334 formed to the size of the CPU 310 so as to store the CPU 310 completely. The duct 302 has the processor fan 304 arranged between the CPU 310 and the 1st opening of the 1st air vent 316 and cool air 322 is blown in from outside the chassis 300 by applying electric power to the fan 304 and blown directly to the heat sink fins 308 of the CPU 310, which is cooled. |
| format | Patent |
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SOLUTION: In a chassis 300, the dust 302 having a 1st opening connected to the 1st air vent 316 and a 2nd opening for the CPU 310 is formed. The 2nd opening of the duct 302 has a CPU storage part 334 formed to the size of the CPU 310 so as to store the CPU 310 completely. 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The duct 302 has the processor fan 304 arranged between the CPU 310 and the 1st opening of the 1st air vent 316 and cool air 322 is blown in from outside the chassis 300 by applying electric power to the fan 304 and blown directly to the heat sink fins 308 of the CPU 310, which is cooled.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBz9vf38fRzV3BxDfN0dlVw8w9ScPVxdQ4J8vfzdFZw9vcNCA1xDeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR6GhoZmhsbmlo7GxKgBAMSPI8I</recordid><startdate>19990618</startdate><enddate>19990618</enddate><creator>ARTURO MEUNIOTTO</creator><creator>SAN FUN KIM</creator><creator>RALPH ROBERT REIN</creator><scope>EVB</scope></search><sort><creationdate>19990618</creationdate><title>COOLING DEVICE FOR ELECTRONIC COMPUTER</title><author>ARTURO MEUNIOTTO ; SAN FUN KIM ; RALPH ROBERT REIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH11161379A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ARTURO MEUNIOTTO</creatorcontrib><creatorcontrib>SAN FUN KIM</creatorcontrib><creatorcontrib>RALPH ROBERT REIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARTURO MEUNIOTTO</au><au>SAN FUN KIM</au><au>RALPH ROBERT REIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING DEVICE FOR ELECTRONIC COMPUTER</title><date>1999-06-18</date><risdate>1999</risdate><abstract>PROBLEM TO BE SOLVED: To cool the components of a host unit in slim chassis design by connecting a duct between a 1st air vent and a processor and installing a fan between the 1st air vent and processor. 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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
| title | COOLING DEVICE FOR ELECTRONIC COMPUTER |
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