HOT DIPPING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a hot dipping equipment with which molten plating metal is easily changed over and the mixture of the different molten plating metal attending on changing-over is reduced. SOLUTION: This hot dipping equipment is provided with a hollow pot 12 applying the plating of t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUEMORI HIDEAKI, KATO CHIAKI, AMAGASA TOSHIAKI, MORITA YOSHIKAZU, HASHIDA TAKUYA, KAWAMIZU TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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