ELECTRONIC COMPONENT MOUNTING METHOD AND ITS DEVICE

PROBLEM TO BE SOLVED: To enable the highly reliable mounting of electronic components to a board by removing such a trouble that the side of the interval between the pitches of leads becomes larger than the interval between the pitches of the electrode pads of the board, and preventing the occurrence of bonding defect. SOLUTION: This electronic component mounting method is one which mounts an electronic component which has a plurality of leads juxtaposed at fixed pitches on a board 1 which has an electrode pad 5 by connecting the above lead to the electrode pad 5 through an anisotropic conductive film. In this case, to begin with, the above electronic component is placed, being positioned on the board 1 through the above anisotropic conductive film. Next, the lead of the electronic component being positioned this way is fixed temporarily by an adhesive while being pressure-bonded to the board 1. Then, the lead of the electronic component temporarily fixed this way is heated and pressure-bonded.