SEMICONDUCTOR CHIP PACKAGE HAVING COLUMN LEAD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To cut down the manufacturing cost by a method wherein a polyimide film is formed on a column lead material so as to form a die pad and a plurality of column leads separated from the die pad on the surface of the polyimide film by an etching process. SOLUTION: After the formati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAI KANKIN, RI KICHIN, KEN NEIDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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