PRODUCTION OF PACKAGE BOARD FOR HYBRID PHOTOELECTRONIC INTEGRATED CIRCUIT

PROBLEM TO BE SOLVED: To obtain a package board which can be easily and economically produced and has good electric characteristics by patterning an electric wiring part when a core layer is patterned and forming a dielectric layer comprising a part of an optical waveguide on the substrate where the electric wiring part is formed. SOLUTION: A lower clad layer 6d and a core layer 7c are successively deposited on a flat substrate (Si substrate) 1c. The core layer 7c is patterned by reactive ion etching method RIE method) using a fluorine-based gas. During this process, the core pattern is formed not only in a region where light is to be guided but in an electric wiring part. By forming an optical waveguide by RIE to expose the Si substrate 1a where optical elements are to be mounted. During this process, the core pattern around the electric wiring part is transferred to automatically form a lower clad layer 6a having the same thickness as the core layer 7c. Then in the final process, an insulating film 9b, conductive layer 12a and soldering layer 13a are formed to complete the production of a package board.